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Journal of Electronic Materials

Volumn 38, Issue 11, 2009, Pages 2242-2250

Interfacial reactions and microstructures of Sn-0.7Cu-xZn solders with ni-P UBM during thermal aging

(5) Cho, Moon Gi a Kang, Sung K b Seo, Sun Kyoung a Shih, Da Yuan b Lee, Hyuck Mo a

a Korea Advanced Institute of Science and Technology (KAIST) (South Korea)

b IBM T J WATSON RESEARCH CENTER (United States)

Author keywords

Electroless Ni P; Hardness; Interfacial reactions; Microstructure; Pb free solders; Shear strength; Zinc

Indexed keywords

ELECTROLESS NI-P; IMC THICKNESS; INTERFACIAL REACTIONS; INTERMETALLIC COMPOUNDS; MATRIX; PB-FREE SOLDERS; SN-0.7CU SOLDER; THERMALLY STABLE; UNDER-BUMP METALLURGIES; ZN CONTENT;

HARDNESS; LEAD; MECHANICAL PROPERTIES; MICROSTRUCTURE; NICKEL; SEMICONDUCTING INTERMETALLICS; SHEAR STRENGTH; SOLDERING ALLOYS; THERMAL AGING; ZINC;

TIN;

EID: 70349873362 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0867-3 Document Type: Article

Times cited : (22)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.