An investigation of Sn pest in pure Sn and Sn-based solders

Microelectronics Reliability

Volumn 49, Issue 1, 2009, Pages 86-91

  Peng, Weiqun ^a  

^a AALTO UNIVERSITY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

BRAZING; COPPER; COPPER ALLOYS; LEAD; MECHANICAL PROPERTIES; METALLIC COMPOUNDS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TELECOMMUNICATION EQUIPMENT; TIN ALLOYS; TITANIUM COMPOUNDS; WELDING;

INFLUENTIAL FACTORS; LOW TEMPERATURES; PURE TINS; SOLDER ALLOYS; SOLDER COMPOSITIONS; TEST TEMPERATURES; TIN PESTS;

TIN;

EID: 58149136051     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.11.001     Document Type: Article

References (21)

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