Study of cooling rate on lead-free soldering microstructure of Sn-3.0Ag-0.5Cu solder

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC

Volumn 2005, Issue , 2005, Pages 156-160

  Hu, Qiang ^a,c   Lee, Zhong Suo ^a,d   Zhao, Zhi Li ^b   Lee, Da Le ^b  

^a Sun East Technology (Holdings) Ltd   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c SunEast Lead free Soldering R and D Center   (United States)

^d R and D Department   (Belgium)

Author keywords

Cooling rate; IMC; Lead free soldering; Microstructure

Indexed keywords

AIR COOLING; COOLING RATE; IMC; LEAD-FREE SOLDERING;

COOLING SYSTEMS; DENDRIMERS; LEAD; MICROSTRUCTURE; MORPHOLOGY; SOLDERING; TIN ALLOYS;

SOLDERING ALLOYS;

EID: 33744991975     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/AGEC.2005.1452335     Document Type: Conference Paper

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