Fatigue damage modeling in solder interconnects using a cohesive zone approach

International Journal of Solids and Structures

Volumn 42, Issue 3-4, 2005, Pages 927-942

  Abdul Baqi, A ^a   Schreurs, P J G ^a   Geers, M G D ^a  

^a EINDHOVEN UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

Cohesive zone; Fatigue damage; Life time; Solder joint

Indexed keywords

COHESIVE ZONE; FATIGUE DAMAGE; LIFE-TIME;

CYCLIC LOADS; DEGRADATION; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; RELIABILITY; SILICON;

SOLDERED JOINTS;

EID: 11244331550     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2004.07.026     Document Type: Article

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