Nanoindentation measurements and mechanical testing of as-soldered and aged Sn-0.7Cu lead-free miniature joints

Materials Science and Engineering: A

Volumn 527, Issue 16-17, 2010, Pages 4014-4020

  Rosenthal, Y ^a   Stern, A ^a   Cohen, S R ^b   Eliezer, D ^a  

^a BEN GURION UNIVERSITY OF THE NEGEV   (Israel)

^b WEIZMANN INSTITUTE OF SCIENCE   (Israel)

Author keywords

Intermetallic compounds; Lead free solders; Mechanical properties; Nanoindentation; Strain rate sensitivity

Indexed keywords

BINARY ALLOYS; COPPER; COPPER ALLOYS; EUTECTICS; FRACTURE; HARDNESS; INTERFACES (MATERIALS); INTERMETALLICS; LEAD ALLOYS; LEAD-FREE SOLDERS; SOLDERED JOINTS; SOLDERING; STRAIN RATE; TENSILE TESTING; TIN ALLOYS;

CU SUBSTRATE; EUTECTIC SOLDERS; EXPOSED TO; HARDNESS AND MODULUS; INDENTATION HARDNESS; INDENTATION MODULUS; INTERMETALLICS COMPOUNDS; NANO INDENTATION; STRAIN-RATE SENSITIVITY; STRAIN-RATES;

NANOINDENTATION;

EID: 77952877992     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2010.03.006     Document Type: Article

References (22)

1. Amagai M., Watanabe M., Omiya M., Kishimoto K., Shibuya T. Microelectron. Reliab. 2002, 42:951-966.
2. Fouassier O., Heintz J.-M., Chazelas J., Geffroy P.-M., Silvain J.-F. J. Appl. Phys. 2006, 100:043519.
3. Rosenthal Y., Sabag O., Tourgeman A., Zalkind S., Stern A., Eliezer D. J. Test. Eval. 2008, 36(September (5)).
4. Oliver W.C., Pharr G.M. J. Mater. Res. 1992, 7:1564.
5. Sun Y., Liang J., Xu Z.-H., Wang G., Li X. J. Mater. Sci.: Mater. Electron. 2008, 19:514-521.
6. Li D., Liu C., Conway P.P. Mater. Sci. Eng. 2005, A391:95-103.
7. Yang P.-F., Lai Y.-S., Jian S.-R., Chen J., Chen R.-S. Mater. Sci. Eng. 2008, A485:305-310.
8. Deng X., Koopman M., Chawla N., Chawla K.K. Mater. Sci. Eng. 2004, A364:240-243.
9. Gao F., Takemoto T. Mater. Lett. 2006, 60:2315-2318.
10. Xu L., Pang J.H-L. J. Electron. Mater. 2006, 35(12):2107-2115.
11. Oliver W.C., Pharr G.M. J. Mater. Res. 2004, 19(1):3-20.
12. Chromik R.R., Vinci R.P., Allen S.L., Notis M.R. JOM 2003, June:66-69.
13. Shohji I., Yoshida T., Takahashi T., Hioki S. Mater. Sci. Eng. 2004, A366:50-55.
14. Dao M., Chollacoop N., Van Vliet K.J., Venkatesh T.A., Suresh S. Acta Mater. 2001, 49:3899-3918.
15. Pharr G.M., Strader J.H., Oliver W.C. J. Mater. Res. 2009, 24:653-666.
16. Nix W.D., Gao H. J. Mech. Phys. Solids 1998, 46:411-425.
17. Kedem N., Stern A., Rosenthal Y. Ann. " Dunarea De Jos" , Univ. Galati, Romania, Fascicle XII, Weld. Equip. Technol. 2009, XX:41-44. 1221-4639.
18. Mayappan R., Ismail A.B., Ahmad Z.A., Ariga T., Hussain L.B. J. Alloys Compd. 2007, 436:112-117.
19. Deng X., Chawla N., Chawla K.K., Koopman M. Acta Mater. 2004, 52:4291-4303.
20. Lang P., Tanaka H., Munegata O., Tagushi T., Narita T. Mater. Charact. 2005, 54:223-229.
21. Abell K.C.R., Chen Y.-L. Acta Mater. 2002, 50:3191-3202.
22. Müller W.H., Worrack H., Sterthaus J., Villain J., Wilden J., Juritza A. Microsyst. Technol. 2009, 15:45-55.