Wetting behaviour and evolution of microstructure of Sn-Ag-Zn solders on copper substrates with different surface textures

Journal of ASTM International

Volumn 7, Issue 9, 2010, Pages

  Satyanarayan, ^a   Prabhu, K Narayan ^a  

^a NATIONAL INSTITUTE OF TECHNOLOGY KARNATAKA   (India)

Author keywords

Contact angle; EPL; IMCs; Lead free solders; Wetting

Indexed keywords

COPPER SUBSTRATES; EPL; IMCS; INTERMETALLIC COMPOUNDS; INTERMETALLIC GROWTH; LEAD-FREE SOLDERS; POWER LAW; ROUGH SURFACES; SCALLOP-SHAPED; SMOOTH SURFACE; SN-AG-ZN; SOLDER MATRIX; SURFACE TEXTURES; WETTING BEHAVIOUR;

CONTACT ANGLE; COPPER; METAL ANALYSIS; MICROSTRUCTURAL EVOLUTION; SEMICONDUCTING INTERMETALLICS; SILVER; SOLDERING ALLOYS; SUBSTRATES; SURFACE MEASUREMENT; SURFACE PROPERTIES; SURFACE ROUGHNESS; TEXTURES; WETTING; ZINC;

TIN;

EID: 77957883518     PISSN: None     EISSN: 1546962X     Source Type: Journal    
DOI: 10.1520/JAI103052     Document Type: Article

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