Electromigration Studies on Sn(Cu) Alloy Lines

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1515-1522

  Lu, C C ^a   Wang, S J ^a   Liu, C Y ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

Electromigration; Pb free solder

Indexed keywords

CATHODES; COPPER; COPPER ALLOYS; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; LEAD; SOLDERING ALLOYS; TENSILE STRESS;

PB-FREE SOLDER; SOLDER LINES;

TIN ALLOYS;

EID: 0942299491     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0123-1     Document Type: Conference Paper

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