Effect of strain rate and temperature on the tensile properties of tin-based lead-free solder alloys

Journal of Electronic Materials

Volumn 37, Issue 7, 2008, Pages 1012-1019

  Bai, Ning ^a   Chen, Xu ^a   Fang, Zhou ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Activation energy; Elongation; Lead free solders; Strain rate sensitivity; Tensile properties

Indexed keywords

ACTIVATION ENERGY; ELONGATION; EUTECTICS; SENSITIVITY ANALYSIS; STRAIN RATE; TENSILE PROPERTIES; TIN ALLOYS;

EUTECTIC SOLDERS; SENSITIVITY INDEX;

SOLDERING ALLOYS;

EID: 43749098538     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0445-0     Document Type: Article

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