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Journal of Applied Physics

Volumn 102, Issue 6, 2007, Pages

Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu

(3) Suh, J O a,c Tu, K N a Tamura, N b

a University of California

b LAWRENCE BERKELEY NATIONAL LABORATORY (United States)

c CALIFORNIA INSTITUTE OF TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANGULAR DISTRIBUTION; COPPER ALLOYS; GRAIN BOUNDARIES; SOLDERING ALLOYS; SUBSTRATES; SYNCHROTRON RADIATION;

ORIENTATION DISTRIBUTION; ORIENTATION RELATIONSHIPS; PSEUDOHEXAGONAL STRUCTURES; WETTING REACTIONS;

CRYSTAL ORIENTATION;

EID: 34848872225 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.2776002 Document Type: Article

Times cited : (76)

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