Five solder families and how they work

Advanced Materials and Processes

Volumn 161, Issue 12, 2003, Pages 26-29

  Bastow, Eric ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS ASSEMBLY INDUSTRY; LEAD FREE SOLDER ALLOYS; TIN BEARING SOLDERS; TIN LEAD SOLDER ALLOYS;

ANTIMONY; BISMUTH; BONDING; COPPER; FLUXES; GOLD; INDIUM; LEAD; SILVER; SURFACE MOUNT TECHNOLOGY; TIN; ZINC;

SOLDERING ALLOYS;

EID: 4444335402     PISSN: 08827958     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (0)