A comparative study of reactive wetting of lead and lead-free solders on cu and (Cu 6Sn 5/Cu 3Sn)/Cu substrates

Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1640-1647

  Wang, Hongqin ^a,b,c   Zhao, Hui ^a   Sekulic, Dusan P ^a,d   Qian, Yiyu ^b  

^a Center for Manufacturing   (United States)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

^c SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

^d UNIVERSITY OF KENTUCKY   (United States)

Author keywords

Bonding; Intermetallics; Lead free solders; Wetting

Indexed keywords

BONDING; COMPARATIVE STUDIES; INTERMETALLICS; LEAD-FREE SOLDERING; LEAD-FREE SOLDERS; REACTIVE WETTING;

BRAZING; COPPER; LEAD; WELDING; WETTING;

COPPER ALLOYS;

EID: 51849149868     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0502-8     Document Type: Article

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