Measuring the mechanical properties of Pb-free solder and Sn-based intermetallics by nanoindentation

JOM

Volumn 55, Issue 6, 2003, Pages 66-69

  Chromik, Richard R ^a   Vinci, R P ^a   Allen, S L ^a   Notis, M R ^a  

^a Lehigh University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER ALLOYS; ELECTRONICS PACKAGING; HARDNESS; INDENTATION; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; MECHANICAL VARIABLES MEASUREMENT; MICROELECTRONICS; PLASTICITY; SILVER ALLOYS;

LEAD FREE SOLDERS; MICROELECTRONIC PACKAGES; NANOINDENTATION; TIN BASED INTERMETALLICS;

SOLDERING;

EID: 0038148655     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-003-0144-5     Document Type: Article

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