Adhesion-delamination phenomena at the surfaces and interfaces in microelectronics and MEMS structures and packaged devices

Journal of Physics D: Applied Physics

Volumn 44, Issue 3, 2011, Pages

  Khanna, V K ^a  

^a CENTRAL ELECTRONICS ENGINEERING RESEARCH INSTITUTE   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION CHARACTERISTIC; ADHESION LAYER; CHIP FABRICATION; CHIP-MANUFACTURING; DESIGN CONSIDERATIONS; FINISHED PRODUCTS; MEMS-STRUCTURE; MEMSDEVICES; METALLIZATIONS; MICRO ELECTRO MECHANICAL SYSTEM; MOVING PARTS; PACKAGED DEVICE; PHYSICO-CHEMICAL MECHANISMS; POTENTIAL RISKS; PROCESS ENGINEER; PROCESS STAGES; RESEARCH TRENDS; SURFACES AND INTERFACES; SUSPENDED STRUCTURE;

ADHESION; COMPOSITE MICROMECHANICS; DELAMINATION; EQUIPMENT; FILM PREPARATION; MEMS; MICROELECTRONICS; OHMIC CONTACTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES; STEEL SHEET; SURFACES;

MICROELECTROMECHANICAL DEVICES;

EID: 78650652063     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/44/3/034004     Document Type: Article

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