Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

Microelectronics Reliability

Volumn 49, Issue 8, 2009, Pages 853-860

  van der Sluis, O ^a,b   Engelen, R A B ^a   Timmermans, P H M ^a   Zhang, G Q ^b,c  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVE MATRIXES; AROMATIC POLYESTERS; COHESIVE FAILURES; COMPRESSIVE STRAIN; CRITICAL REGION; DIELECTRIC LAYER; FAILURE CRITERIA; FINITE ELEMENT SIMULATIONS; FLEXIBLE DISPLAYS; FLEXIBLE ELECTRONICS; FRACTURE SENSITIVITY; HIGH TEMPERATURE; INDIUM TIN OXIDE LAYERS; INTERFACE PROPERTY; MULTI-LAYERED; MULTI-SCALE APPROACHES; MULTI-SCALE MODELLING; MULTILAYER STRUCTURES; PATTERNING EFFECTS; PIXEL DIMENSION; PIXEL GEOMETRY; PIXEL LEVEL; REALISTIC MATERIALS; TWO-POINT BENDING;

COMPUTATIONAL GEOMETRY; FAILURE ANALYSIS; LOCATION; QUALITY ASSURANCE; SAFETY FACTOR; SENSITIVITY ANALYSIS; SILICA; STEEL SHEET; THIN FILM TRANSISTORS; THIN FILMS; TIN;

PIXELS;

EID: 67650444295     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.03.013     Document Type: Article

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