Adhesion studies in integrated circuit interconnect structures

Engineering Failure Analysis

Volumn 14, Issue 2, 2007, Pages 349-354

  Molina Aldareguia, J M ^a   Ocana I ^a   Gonzalez D ^a   Elizalde, M R ^a   Sanchez J M ^a   Martinez Esnaola J M ^a   Gil Sevillano, J ^a   Scherban, T ^b   Pantuso, D ^b   Sun, B ^b   Xu, G ^b   Miner, B ^b   He, J ^b   Maiz, J ^b  

^a UNIVERSITY OF NAVARRA   (Spain)

^b INTEL CORPORATION   (United States)

Author keywords

Fracture; Interconnects; Interfaces; Nanoindentation; Thin films

Indexed keywords

ADHESION; CHARACTERIZATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; INDENTATION; INTERFACES (MATERIALS); ION BEAMS; MECHANICAL PROPERTIES; SILICON; THERMAL STRESS; THIN FILMS;

BERKOVICH INDENTER; FOUR-POINT BENDING; INTERCONNECT STRUCTURES; MODIFIED CROSS-SECTIONAL NANOINDENTATION (MCSN); PACKAGE/SILICON INTERACTION; PATTERNED STRUCTURES;

INTEGRATED CIRCUIT TESTING;

ADHESION; CHARACTERIZATION; CRACK PROPAGATION; ELECTRONICS PACKAGING; INDENTATION; INTEGRATED CIRCUIT TESTING; INTERFACES (MATERIALS); ION BEAMS; MECHANICAL PROPERTIES; SILICON; THERMAL STRESS; THIN FILMS;

EID: 33749322522     PISSN: 13506307     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfailanal.2006.02.008     Document Type: Article

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