Invited paper environmental effects on interfacial adhesion

Microelectronics Reliability

Volumn 41, Issue 9-10, 2001, Pages 1615-1624

  Lane, M W ^a   Snodgrass, J M ^b   Dauskardt, R H ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DEBONDING; ENVIRONMENTAL IMPACT; INTERFACES (MATERIALS); MOISTURE; SILICA; THERMAL EFFECTS;

THIN FILM INTERCONNECT STRUCTURES;

THIN FILM DEVICES;

EID: 0035456690     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00150-0     Document Type: Article

References (11)

1. M. Lane, N. Krishna, I. Hashim, and R. H. Dauskardt, J. Mat. Res., 15, [1] 203-211 2000.
2. M. Lane, W. Ni, R. H. Dauskardt, H. Fujimoto, Q. Ma and N. Krishna, in Proc. MRS Annual Meeting, 357-362, 1997.
3. M. Lane, A. Vainchtein, H. Gao, R. H. Dauskardt, J. Mat. Res., 15, [12] 2758-2769, 2000.
4. J. W. Hutchinson and Z. Suo, "Mixed Mode Cracking in Layered Materials. Advances in Applied Mechanics, ed. J. W. Hutchinson and T. Y. Yu, 63 - 191 (New York, Academic Press, 1991).
5. S. M. Wiederhorn, J. Am. Ceram. Soc., 1967, 50, 407-414.
6. B. R. Lawn, Mat. Sci. Eng., 1974, 13, 277-283.
7. A. Bhatnagar, M. J. Hoffman, R. H. Dauskardt, Amer. Germ. Soc., in press.
8. J. Mencik, "Strength and Fracture of Glass and Ceramics," Elsevier Science Publishers, (1992).
9. S. M. Wiederhorn, E. R. Fuller Jr. and R. Thomson, Met. Sci., 1980, Aug., 450-458.
10. B. R. Lawn, J. Mats. Sci., 1975, 18, 469-480.
11. R. F. Cook and E. G. Liniger, Am. Cerm. Soc., 1992.