Stress and moisture effects on thin film buckling delamination

Experimental Mechanics

Volumn 47, Issue 1, 2007, Pages 163-170

  Waters, P ^a   Volinsky, A A ^a  

^a University of South Florida   (United States)

Author keywords

Adhesion; Buckling delamination; Environmentally assisted fracture; Stress; Telephone cord; Thin films

Indexed keywords

ENVIRONMENTALLY ASSISTED FRACTURE; INTERFACIAL TOUGHNESS; SUPERLAYER INDENTATION TEST;

ADHESION; BUCKLING; COPPER; DIAMOND LIKE CARBON FILMS; MOISTURE; RESIDUAL STRESSES; SPUTTER DEPOSITION; STRAIN ENERGY; THIN FILMS; TOUGHNESS;

TUNGSTEN;

ADHESION; BUCKLING; COPPER; DIAMOND LIKE CARBON FILMS; MOISTURE; RESIDUAL STRESSES; SPUTTER DEPOSITION; STRAIN ENERGY; THIN FILMS; TOUGHNESS; TUNGSTEN;

EID: 33947405611     PISSN: 00144851     EISSN: 17412765     Source Type: Journal    
DOI: 10.1007/s11340-006-9346-4     Document Type: Article

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