Influence of temperature and humidity on adhesion of underfills for flip chip packaging

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 1, 2005, Pages 88-94

  Luo, Shijian ^a   Wong, C P ^b  

^a MICRON TECHNOLOGY INC   (United States)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Aging; Benzocyclobutene (BCB); Coupling agent; Flip chip; Passivation; Polyimide (PI); Si3N4; SiO2; Underfill

Indexed keywords

ADHESION; AGENTS; AGING OF MATERIALS; ATMOSPHERIC HUMIDITY; FLIP CHIP DEVICES; HYDROPHILICITY; PASSIVATION; POLYIMIDES; SILICA; SILICON NITRIDE; STRENGTH OF MATERIALS; THERMAL EFFECTS;

BENZOCYCLOBUTENE (BCB); COUPLING AGENT; FLIP CHIP PACKAGING; UNDERFILLS;

ELECTRONICS PACKAGING;

EID: 15744395109     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2004.838872     Document Type: Article

References (14)

1. D. Suryanarayana, T. Y. Wu, and J. A. Varcoe, "Encapsulants used in flip-chip packages," in Proc. 43rd Electronic Components and Technology Conf., Orlando, FL, 1993, pp. 193-198.
2. A. Babiarz and S. J. Adamson, "Underfill and encapsulation," Adv. Packag., p. 51, May 2000.
3. J. C. W. van Vroonhoven, "Effects of adhesion and delamination on stress singularities in plastic-packaged integrated circuits," J. Electron. Packag., vol. 115, pp. 28-32, 1993.
4. C. K. Gurumurthy, J. Jiao, L. G. Norris, C. Y Hui, and E. J. Kramer, "A new approach for thermal fatigue testing of the underfill/ passivation interface," in Application of Fracture Mechanics in Electronic Packaging. New York: ASME, 1997, pp. 41-48.
5. T. Y. Wu, Y. Tsukada, and W. T. Chen, "Materials and mechanics issues in flip-chip organic packaging," in Proc. 46th Electronic Components and Technology Conf., 1996, p. 524.
6. X. Dai, M. V. Brillhart, and P. S. Ho, "Polymer interfacial adhesion in microelectronic assemblies," in Proc. 48th Electronic Components and Technology Conf., 1998, p. 132.
7. C. K. Gurumurthy, L. G. Norris, C.-Y. Hui, and E. J. Kramer, "Characterization of underfill/passivation interfacial adhesion for direct chip attach assemblies using fracture toughness and hydro-thermal fatigue measuremeuts," in Proc. 48th Electronic Components and Technology Conf., 1998, p. 721.
8. S. Shi, "Improved solder joint fatigue life time and alleviated fillet crack," Ph.D. dissertation, Georgia Inst. Technol., Atlanta, 2000.
9. M. B. Vincent, L. Meyers, and C. P. Wong, "Enhancement of underfill adhesion to die and substrate by use of silane additives," in Proc. Int. Symp. Advanced Packaging Materials: Process, Properties and Interfaces, Braselton, GA, 1998, p. 49.
10. S. Luo and C. P. Wong, "Investigation on effect of coupling agents in epoxy based underfill material for fiip-chip applications," in Proc. 50th Electronic Components Technology Conf., Las Vegas, NV, 2000, p. 311.
11. D. C. C. Lam, F. Yang, and P. Tong, "Chemical kinetic model of interfacial degradation of adhesive joints," IEEE Trans Compon. Packag. Technol., vol. 22, pp. 215-220, June 1999.
12. E. H. Wong, K. C. Chan, R. Rajoo, and T. B. Lim, "The mechanics and impact of hygroscopic swelling of polymeric materials in eleetronic packaging," in Proc. 50th Electronic Components and Technology Conf. 2000, pp. 576-580.
13. C. P. Wong and R. McBride, "Pre-encapsulation cleaning methods and control for microelectronics packaging," IEEE Trans. Compon., Packag., Manufact. Technol. A, vol. 17, pp. 542-552, Dec. 1994.
14. E. H. Andrews, Adhesive Bonding, L.-H. Lee, Ed. New York: Plenum, 1991, p. 337.