Adhesion of arbitrary-shaped thin-film microstructures

Microelectronics Reliability

Volumn 47, Issue 12, 2007, Pages 2014-2024

  Bhate, Dhruv ^a   Dunn, Martin L ^a  

^a UCB 450   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFEROMETRY; MICROSTRUCTURE; MICROSYSTEMS; POLYSILICON;

ADHESION ENERGY; POLYSILICON MICROCANTILEVERS; SQUARE PLATE MICROSTRUCTURES; THREE-DIMENSIONAL LINEAR ELASTIC FRACTURE MECHANICS;

THIN FILMS;

EID: 35549009269     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.04.011     Document Type: Article

References (30)

1. Van Spengen W.M., Puers R., and De Wolf I. IEEE Trans Dev Mater Reliab 3 (2003) 167-172
2. Jafri I, Busta H, Walsh ST. Critical point drying and cleaning for MEMS technology. In: Lawton RA, Miller WM, Lin G, Rajeshuni Ramesham, editors. Proceedings of SPIE, MEMS reliability for critical and space applications. Bellingham, WA: Society of Photo Optical Instrumentation Engineers (SPIE); 1999, vol. 3880, 51-8.
3. De Boer MP, Knapp JA, Mayer TM, Michalske TA. The role of interfacial properties on MEMS performance and reliability. In: SPIE/EOS conference on Microsystems metrology and inspection, Munich; 1999.
4. Komvopoulos K. Adhesion and friction forces in microelectromechanical systems: mechanisms, measurement, surface modification techniques, and adhesion theory. J Adhesion Sci Technol 17 4 (2003) 477-517
5. Zhao Y.P., Wang L.S., and Yu T.X. Mechanics of adhesion in MEMS - a review. J Adhesion Sci Technol 17 4 (2003) 519-546
6. DelRio F., de Boer M.P., Knapp J.A., Clews P.J., and Dunn M.L. The role of van der Waals forces in adhesion of micromachined surfaces. Nature Mater 4 (2005) 629-634
7. Mastrangelo CH, Hsu CH. A simple experimental technique for the measurement of the work of adhesion of microstructures. Solid State Sensor and Actuator Workshop 1992, Tech. Digest (Hilton Head' 92). p. 241-44.
8. Mastrangelo C.H., and Hsu C.H. Mechanical stability and adhesion of microstructures under capillary forces: part I: basic theory. IEEE J Microelectro Systems 2 (1993) 33-43
9. Mastrangelo C.H., and Hsu C.H. Mechanical stability and adhesion of microstructures under capillary forces: part II: experiments. IEEE J Microelectro Systems 2 (1993) 44-55
10. De Boer M.P., and Michalske T.A. Accurate method for determining adhesion of cantilever beams. J Appl Phys 86 2 (1999)
11. Kinloch A.J. Adhesion and adhesives: science and technology (1987), Chapman and Hall
12. Knapp J.A., and De Boer M.P. Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces. J Microelectromech S (2001)
13. Lin M.J., and Chen R. Adhesion criterion for center-anchored circular plates in microstructures. Sensors Actuators A (2002)
14. Tezuka S, Kato S, Watanabe T, Iwaoka H. Analysis and experiments for evaluating adhesion of arbitrary shaped microstructures using optimization method. In: The 11th conference on solid state sensors and actuators, Munich; 2001, June 10-14.
15. De Boer M.P., and Michalske T.A. Improved autoadhesion measurement method for micromachined polysilicon beams. Mater Res Soc Pro 444 (1998) 87-92
16. Rybicki E.F., and Kanninen M.F. A finite element calculation of stress intensity factors by a modified crack closure integral. Eng Fract Mech 9 (1977) 931-938
17. Zheng S., and Sun C.T. A double plate finite element model for the impact induced delamination problem. Compos Sci Technol 53 (1995) 111-118
18. Krueger R. The virtual crack closure technique: history, approach and applications. NASA/CR-2002-211628, ICASE Report No. 2002-10; 2002.
19. Dunn ML. Delamination modeling for laminated composites. Final report to Sandia National Laboratories; 1994.
20. Dunn ML, Reedy Jr ED, Guess TR. Delamination of woven E-glass fabric composites. In: Proceedings of 39th international SAMPE symposium; 1994. p. 1224-36.
21. Horn CK. Delamination modeling of laminated composites. Master's thesis, University of Colorado; 1996.
22. Raju I.S., and Shivakumar K.N. Three dimensional elastic analysis of a composite double cantilever beams specimen. AIAA J 26 12 (1988)
23. Smith S.A., and Raju I.S. Evaluation of stress intensity factors using general finite element models. In: Pantonin T.L., and Sheppard S.D. (Eds). Fatigue and fracture mechanics. ASTM STP 1332 29 (1999) 176-200
24. Jones E.E., Murphy K.D., and Begley M.R. Adhesion of micro-cantilevers subjected to mechanical point loading: modeling and experiments. J Mech Phys Solids 51 8 (2003) 1601-1622
25. ® design handbook. Revision 7.0, Cronos Integrated Microsystems; 2001.
26. Deck L., and De Groot P. High-speed non-contact profiler based on scanning white light interferometry. Int J Machine Tools Manu (1995)
27. Sharpe Jr. W.N., Bagdahn J., Jackson K., and Coles G. Tensile testing of MEMS materials - recent progress. J Mater Sci 38 20 (2003) 4075-4079
28. Jensen H.M. The blister test for interface toughness measurement. Eng Fract Mech 40 3 (1991) 475-486
29. Yu H.H., and He M.Y. Hutchinson, edge effects in thin film delamination. Acta Mater 49 (2001) 93-107
30. ABAQUS, 2002, Version 6.2, Hibbit, Karlsson and Sorenson.