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Volumn 15, Issue 1, 2000, Pages 203-211

Adhesion and reliability of copper interconnects with Ta and TaN barrier layers

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DIELECTRIC MATERIALS; DIFFUSION; ELECTROMIGRATION; ENERGY DISSIPATION; METALLIZING; PLASTICITY; TANTALUM COMPOUNDS; THERMAL EXPANSION;

EID: 0033990021     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2000.0033     Document Type: Article
Times cited : (190)

References (28)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.