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Volumn 15, Issue 1, 2000, Pages 203-211
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Adhesion and reliability of copper interconnects with Ta and TaN barrier layers
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
DIELECTRIC MATERIALS;
DIFFUSION;
ELECTROMIGRATION;
ENERGY DISSIPATION;
METALLIZING;
PLASTICITY;
TANTALUM COMPOUNDS;
THERMAL EXPANSION;
COPPER INTERCONNECTS;
COPPER;
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EID: 0033990021
PISSN: 08842914
EISSN: None
Source Type: Journal
DOI: 10.1557/JMR.2000.0033 Document Type: Article |
Times cited : (190)
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References (28)
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