Adhesion-delamination mechanics of a prestressed circular film adhered onto a rigid substrate

Journal of Adhesion

Volumn 83, Issue 1, 2007, Pages 67-83

  Wong, Ming Fung ^a   Duan, Gang ^a   Wan, Kai Tak ^b  

^a University of Missouri Rolla   (United States)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

Adhesion; Delamination; Pull in; Pull off; Residual stress; Thin film

Indexed keywords

ADHESION; DELAMINATION; ENERGY BALANCE; MATHEMATICAL MODELS; MEMS; RESIDUAL STRESSES; TENSILE STRESS;

BIOLOGICAL CELL ADHESION; COUPLED INTERFACIAL ADHESION; MECHANICAL DELAMINATION PROCESS;

THIN FILMS;

EID: 33847095106     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218460601102878     Document Type: Article

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