Adhesion study on underfill encapsulant affected by flip chip assembly variables

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn , Issue , 2001, Pages 213-217

  Fan, L ^a   Moon, K S ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Adhesion; Flip Chip; Flux; Passivation; Solder Mask; Underfill

Indexed keywords

ENCAPSULATION; FLIP CHIP DEVICES; INTERFACES (MATERIALS); PASSIVATION; POLYMERS; SOLDERED JOINTS;

UNDERFILL MATERIALS;

ADHESION;

EID: 0034998529     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (3)