Investigation of delamination control in plastic package

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 350-356

  Zhao, Shufeng ^a   Pang, Xingshou ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; DELAMINATION; FRACTURE MECHANICS; MECHANICAL PROPERTIES; MOLDING; PACKAGING MATERIALS; PLASTICS; RESINS; SHEET MOLDING COMPOUNDS; STEEL SHEET; STRENGTH OF MATERIALS; THERMAL EXPANSION; VAPOR PRESSURE;

FICK'S LAWS; INTERFACIAL DELAMINATIONS; LEAD-FREE; MECHANICAL RELIABILITIES; MOISTURE ABSORPTIONS; MOISTURE INFLUENCES; MOISTURE SENSITIVITY LEVELS; MOISTURE WEIGHTS; MOLDING COMPOUNDS; PERFORMANCE IMPROVEMENTS; PLASTIC PACKAGES; QUANTITATIVE ANALYSIS; SOLDER REFLOWS; WEIGHT RATIOS;

MOISTURE;

EID: 60849101333     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2009.01.001     Document Type: Article

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