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Volumn 42, Issue 4-5, 2002, Pages 607-627

Mechanical reliability in electronic packaging

Author keywords

[No Author keywords available]

Indexed keywords

CRACKS; DELAMINATION; DISSIMILAR MATERIALS; INTERFACES (MATERIALS); INTERMETALLICS; PLATING; RELIABILITY; SOLDERING; SURFACE CHEMISTRY; ULSI CIRCUITS;

EID: 0036540808     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00037-9     Document Type: Article
Times cited : (32)

References (63)
  • 2
    • 84985394140 scopus 로고
    • Stress distribution in a nonhomogenous elastic plane with cracks
    • (1963) J Appl Mech , vol.30 , pp. 232-236
    • Erdogan, F.1
  • 3
    • 80052903842 scopus 로고
    • Stress distribution in bonded dissimilar materials with cracks
    • (1965) J Appl Mech , vol.32 , pp. 403-410
    • Erdogan, F.1
  • 15
    • 85008269051 scopus 로고
    • Two edge bonded elastic wedges of different materials and wedge angles and surface tractions
    • (1971) J Appl Mech , vol.11 , pp. 377-386
    • Bogy, D.B.1
  • 16
    • 85123615747 scopus 로고
    • Analysis of stresses and strains near the end of a crack traversing a plate
    • (1957) J Appl Mech , vol.24 , pp. 361-364
    • Irwin, G.R.1
  • 33
    • 0342732916 scopus 로고    scopus 로고
    • Characterization of molding compound and die attach materials for package warpage and solder joint reliability in chip scale package
    • Hawaii, USA, June
    • (1999) Proceedings of the ASME InterPack , pp. 1103-1112
    • Amagai, M.1
  • 47
    • 0342732916 scopus 로고    scopus 로고
    • Characterization of molding compound and die attach materials for package warpage and solder joint reliability in chip scale package
    • Hawaii, USA, June
    • (1999) Proceedings of the ASME InterPack , pp. 1103-1112
    • Amagai, M.1
  • 62
    • 0034293761 scopus 로고    scopus 로고
    • Effect of soldering and aging time on interfacial microstructure and growth of intermetallic compounds between Sn-3.5Ag solder alloy and Cu substrate
    • (2000) J Electron Mater , vol.29 , pp. 1207-1213
    • Choi, W.K.1    Lee, H.M.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.