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Volumn 42, Issue 4-5, 2002, Pages 607-627
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Mechanical reliability in electronic packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
CRACKS;
DELAMINATION;
DISSIMILAR MATERIALS;
INTERFACES (MATERIALS);
INTERMETALLICS;
PLATING;
RELIABILITY;
SOLDERING;
SURFACE CHEMISTRY;
ULSI CIRCUITS;
PACKAGING TECHNOLOGY;
ELECTRONICS PACKAGING;
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EID: 0036540808
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-2714(02)00037-9 Document Type: Article |
Times cited : (32)
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References (63)
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