Microsystem packaging: Lessons from conventional low cost IC packaging

Journal of Micromechanics and Microengineering

Volumn 7, Issue 3, 1997, Pages 99-103

  Kelly, G ^a   Alderman, J ^a   Lyden, C ^a   Barrett, J ^a  

^a UNIVERSITY COLLEGE CORK   (Ireland)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONICS; RESIDUAL STRESSES;

MICROSYSTEM PACKAGING;

ELECTRONICS PACKAGING;

EID: 0031220943     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/7/3/004     Document Type: Article

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