Effect of chromium-gold and titanium-titanium nitride-platinum-gold metallization on wire/ribbon bondability

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 4, 2006, Pages 707-713

  Pan, Jianbiao ^a   Pafchek, Robert M ^b   Judd, Frank F ^b   Baxter, Jason B ^c  

^a CALIFORNIA POLYTECHNIC STATE UNIVERSITY   (United States)

^b AGERE SYSTEMS   (United States)

^c YALE UNIVERSITY   (United States)

Author keywords

Chromium; Gold; Metallization; Ribbon bonding; Titanium; Wire bonding

Indexed keywords

ADHESION; AUGER ELECTRON SPECTROSCOPY; BOND STRENGTH (MATERIALS); BONDING; GOLD ALLOYS; METALLIZING; SUBSTRATES;

BONDABILITY; GOLD METALLIZATION; RIBBON BONDING; WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 37849188870     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2006.884774     Document Type: Article

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