Subcritical delamination of dielectric and metal films from low-k organosilicate glass (OSG) thin films in buffered pH solutions

Materials Research Society Symposium - Proceedings

Volumn 795, Issue , 2003, Pages 93-98

  Lin, Y ^a   Vlassak, J J ^a   Tsui, T Y ^b   McKerrow, A J ^b  

^a HARVARD UNIVERSITY   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; DATA REDUCTION; DELAMINATION; IONIC STRENGTH; PH EFFECTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS; SOLUTIONS; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERLAYER DIELECTRIC (ILD); MICROFABRICATION; ORGANOSILICATE GLASS (OSG) FILMS;

DIELECTRIC FILMS;

EID: 2442501483     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-795-u8.1     Document Type: Conference Paper

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