Recent developments in thin film adhesion measurement

IEEE Transactions on Device and Materials Reliability

Volumn 4, Issue 2, 2004, Pages 163-168

  Cordill, Megan J ^a   Bahr, David F ^b   Moody, Neville R ^c   Gerberich, William W ^a  

^a UNIVERSITY OF MINNESOTA   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Adhesion; Interfacial fracture energy; Nanoindentation; Thin films

Indexed keywords

ADHESION; ATOMIC FORCE MICROSCOPY; DELAMINATION; DUCTILITY; ELASTIC MODULI; FRACTURE MECHANICS; MATHEMATICAL MODELS; MICROSTRUCTURE; PLASTICITY; POISSON RATIO;

DIGITAL INSTRUMENTS (DI); INTERFACIAL FRACTURE ENERGY; NANOINDENTATION;

THIN FILMS;

EID: 4043160613     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2004.829071     Document Type: Article

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