A three-dimensional microstructuring technique exploiting the positive photoresist property

Journal of Micromechanics and Microengineering

Volumn 20, Issue 6, 2010, Pages

  Hirai, Yoshikazu ^a   Sugano, Koji ^a   Tsuchiya, Toshiyuki ^a   Tabata, Osamu ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

3D MICROSTRUCTURES; DIAZONAPHTHOQUINONE; DISSOLUTION RATES; FABRICATION TECHNIQUE; FRESNEL DIFFRACTION THEORY; MICRO STRUCTURING; NANO SCALE; PHOTOLITHOGRAPHY PROCESS; PHOTOLITHOGRAPHY SIMULATION; PHOTORESIST DEVELOPMENT; PHOTORESIST LAYERS; QUANTITATIVE AGREEMENT; SIMULATION APPROACH; STANDARD PHOTOLITHOGRAPHY; THREE-DIMENSIONAL (3D); UV LITHOGRAPHY;

LITHOGRAPHY; PHOTORESISTS; STANDARDIZATION; THREE DIMENSIONAL;

DISSOLUTION;

EID: 77952389102     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/20/6/065005     Document Type: Article

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