Enhancement on forming complex three dimensional microstructures by a double-side multiple partial exposure method

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 25, Issue 5, 2007, Pages 1671-1678

  Chung, Junwei ^a   Hsu, Wensyang ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

LITHOGRAPHY; PARAMETER ESTIMATION; PHOTORESISTS; THICKNESS MEASUREMENT; THREE DIMENSIONAL;

ENHANCEMENT EFFECT; MULTILEVEL MORPHOLOGY; PHOTORESIST MICROSTRUCTURES;

MICROSTRUCTURE;

EID: 34648815811     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2781527     Document Type: Article

References (23)

1. C. K. Ullal, M. Maldovan, E. L. Thomas, G. Chen, Y.-J. Han, and S. Yang, Appl. Phys. Lett. 84, 5434 (2004).
2. Y. Y. Li, Science 299, 2045 (2003).
3. B. H. Cumpston, Nature (London) 398, 51 (1999).
4. A. Abbott, Nature (London) 424, 870 (2003).
5. M. Han, W. Lee, S.-K. Lee, and S. S. Lee, Sens. Actuators, A 111, 14 (2004).
6. B.-G. Kim, J.-H. Kim, and E. Yoon, Seventh International Conference on Miniaturized Chemical and Biochemical Analysis Systems, 2003 (unpublished), p. 627.
7. Y.-J. Chuang, F.-G. Tseng, J.-H. Cheng, and W.-K. Lin, Sens. Actuators, A 103, 64 (2003).
8. R. A. Farrer, C. N. LaFratta, L. Li, J. Praino, M. J. Naughton, B. E. A. Saleh, M. C. Teich, and J. T. Fourkas, J. Am. Chem. Soc. 128, 1796 (2006).
9. N.-T. Nguyen, S.-S. Ho, and C. L.-N. Low, J. Micromech. Microeng. 14, 969 (2004).
10. S. J. Jeong and W. Wang, Proc. SPIE 5344, 115 (2004).
11. W. Dai, K. Lian, and W. Wang, Microsyst. Technol. 13, 271 (2007).
12. A. Bertsch, H. Lorenz, and P. Renaud, Sens. Actuators, A 73, 14 (1999).
13. S. Maruo, O. Nakamura, and S. Kawata, Opt. Lett. 22, 132 (1997).
14. S. Kawata, H.-B. Sun, T. Tanaka, and K. Takada, Nature (London) 412, 697 (2001).
15. T. Baldacchini, C. N. LaFratta, R. A. Farrer, M. C. Teich, B. E. A. Saleh, M. J. Naughton, and J. T. Fourkas, J. Appl. Phys. 95, 6072 (2004).
16. C. N. LaFratta, L. Li, and J. T. Fourkas, Proc. Natl. Acad. Sci. U.S.A. 103, 8589 (2006).
17. J. H. Moon and S. Yang, J. Macromol. Sci., Polym. Rev. 45, 351 (2005).
18. M. J. Madou, Fundamentals of Microfabrication, 2nd ed. (CRC, New York, 2002).
19. K.-Y. Hung, H.-T. Hu, and F.-G. Tseng, IEEE Solid State Sensors, Actuators and Microsystems (Transducers'03), 2003 (unpublished), p. 821.
20. Y. Oppliger, P. Sixt, J. M. Stauffer, J. M. Mayor, P. Regnault, and G. Voirin, Microelectron. Eng. 23, 449 (1994).
21. B. Wagner, H. J. Quenzer, W. Henke, W. Hoppe, and W. Pilz, Sens. Actuators, A 46-47, 89 (1995).
22. W. Däschner, P. Long, R. Stein, C. Wu, and S. H. Lee, J. Vac. Sci. Technol. B 14, 3730 (1996).
23. W. Däschner, P. Long, M. Larsson, and S. H. Lee, J. Vac. Sci. Technol. B 13, 2729 (1995).