Thick resist for MEMs processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4592, Issue , 2001, Pages 334-346

  Brown, Joe ^a   Hamel, Clifford ^a  

^a Karl Suss America   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

COATING TECHNIQUES; INTEGRATED CIRCUITS; LITHOGRAPHY; PHOTORESISTS; WSI CIRCUITS;

FLIP-CHIP ASSEMBLY;

MICROELECTROMECHANICAL DEVICES;

EID: 0035770881     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.448985     Document Type: Article

References (3)

1. P. Magill, et al., Considerations for an Electroplated Flip Chip Process, IMAPS Boston May 1998 and private communications.
2. B. Loechel, et al; Influence of Resist Baking on the Pattern Quality of Thick Photoresists, Suss Report, Volume 11, First Quarter 90.
3. E. Cullmann, M. Topper; Thick Photoresist Patterning for WLP Applications, HDI February 2000, page 18-20.