Polymer-core conductor approaches for RF MEMS

Journal of Microelectromechanical Systems

Volumn 14, Issue 5, 2005, Pages 886-894

  Yoon, Yong Kyu ^a   Park, Jin Woo ^a   Allen, Mark G ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Double exposure single development; Epoxy core conductor; High aspect ratio solenoid inductor; Polymer core conductor; Radio frequency (RF) microelectromechanical systems (MEMS); SU 8 bridge fabrication

Indexed keywords

ASPECT RATIO; CONDUCTIVE PLASTICS; ELECTRIC CONDUCTORS; ELECTRIC CURRENTS; ELECTRIC INDUCTORS; EPOXY RESINS; INDUCTANCE MEASUREMENT; METALLIZING; Q FACTOR MEASUREMENT; SKIN EFFECT;

BRIDGE FABRICATION; DOUBLE-EXPOSURE-SINGLE-DEVELOPMENT; EPOXY-CORE CONDUCTOR; HIGH-ASPECT-RATIO SOLENOID INDUCTOR; POLYMER-CORE CONDUCTOR; RADIO FREQUENCY (RF) MICROELECTROMECHANICAL SYSTEMS;

MICROELECTROMECHANICAL DEVICES;

EID: 27644550924     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2005.851804     Document Type: Article

References (22)

1. Y. J. Kim and M. G. Allen, "Surface micromachined solenoid inductors for high frequency applications," IEEE Trans. Compon., Packag., Manuf. Technol., pt. C. vol. 21, no. 1, pp. 26-33, Jan. 1998.
2. J. Y. Park and M. G. Allen, "High Q spiral-type microinductors on silicon substrates," IEEE Trans. Magn., vol. 135, pp. 3544-3546, 1999.
3. Y.-K. Yoon, J.-W. Park, and M. G. Allen, "RF MEMS based on epoxy-core conductors," in Dig. Solid-State Sensor, Actuator, and Microsystems Workshop 2002, Hilton Head Island, SC, 2002, pp. 374-375.
4. M. Despont, H. Lorenz, N. Fahrni, J. Brugger, P. Renaud, and P. Vettiger, "High-aspect-ratio, untrathick, negative-tone near-UV photoresist for MEMS applications," Proc. IEEE Microelectromech. Syst., pp. 518-522, 1997.
5. H. Lorenz, M. Despont, N. Fahrni, J. Brugger, P. Vettiger, and P. Renaud, "High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS," Sens. Actuators, vol. A 64, pp. 33-39, 1998.
6. Y.-K. Yoon, J.-H. Park, F. Cros, and M. G. Allen, "Integrated vertical screen microfilter system using inclined SU-8 structures," in Proc. IEEE Microelectromech. Syst. (MEMS), Kyoto, Japan, 2003, pp. 227-230.
7. H. Sato, T. Kakinuma, J. S. Go, and S. Shoji, "A novel fabrication of in-channel 3-D micromesh structure using maskless multi-angle exposure and its microfilter application," in Proc. IEEE Microelectromech. Syst. (MEMS), Kyoto, Japan, 2003, pp. 223-226.
8. M. Han, W. Lee, S. K. Lee, and S. S. Lee, "Fabrication of 3D microstructures with inclined/rotated UV lithography," in Proc. IEEE Microelectromech. Syst. (MEMS), 2003, pp. 554-557.
9. J.-H. Park, Y.-K. Yoon, M. R. Prausnitz, and M. G. Allen, "High-Aspect-Ratio tapered structure using an integrated lens technique," in Proc. IEEE Microelectromech. Syst. (MEMS), Maastricht, The Netherlands, 2004, pp. 383-386.
10. Y. Choi, R. Powers, V. Vernekar, A. B. Frazier, M. LaPlaca, and M. G. Allen, "High aspect ratio SU-8 structures for 3-D culturing of neurons," in Proc. ASME Int. Mechan. Eng. Congress and Exposition, Nov. 2003.
11. F. C. Tseng, Y. J. Chuang, and W. K. Lin, "A novel fabrication method of embedded micro channels employing simple UV dosage control and antireflection coating," in Proc. IEEE Microelectromech. Syst. (MEMS), Las Vegas, NV, 2002, pp. 69-72.
12. A. O. Aggarwal, K. Naeli, P. M. Raj, F. Ayazi, S. Bhattacharya, and R. R. Tummala, "MEMS composite structures for tunable capacitors and IC-package nano interconnects," in Proc. IEEE ECTC, 2004.
13. W. E. Feely, J. C. Imhof, and C. M. Stein, "The role of the latent image in a new dual image, aqueous developable, thermally stable photoresist," Polym. Eng. Sci., vol. 26, pp. 1101-1104, 1986.
14. W. E. Feely, "Micro-Structures," in Tech. Dig. Solid State Sensor and Actuator Workshop, Hilton Head Island, SC, 1988, pp. 13-15.
15. P. Six, "Phase masks and grey-tone masks," in Semiconductor Fabtech, 1995.
16. 2) for RF applications using simple 3D surface micromachining technology," in Tech. Dig. IEEE Int. Electron Devices Meeting (IEDM '98), 1998, pp. 544-547.
17. J.-D. Lee, J.-B. Yoon, J.-K. Kim, H.-J. Chung, C.-S. Lee, H.-D. Lee, H.-J. Lee, C.-K. Kim, and C.-H. Han, "A thermal inkjet printhead with a monolithically fabricated nozzle plate and self-aligned ink feed hole," IEEE J. Microelectromech. Syst., vol. 8, no. 3, pp. 229-236, 1999.
18. Y.-H. Joung, "Electroplating bonding technology for chip interconnect, wafer level packaging and interconnect layer structures," Ph.D., Georgia Inst. Technol., Atlanta, 2003.
19. J.-B. Yoon, B.-K, Kim, C.-H. Han, E. Yoon, and C.-K. Kim, "Surface micromachined solenoid on-Si and on-glass inductors for RF applications," IEEE Electron Dev. Lett., vol. 20, pp. 487-489, 1999.
20. Y.-K. Yoon, E. Chen, M. G. Allen, and J. Laskar, "Embedded solenoid inductors for RF CMOS power amplifier," in Dig. 11th Int. Conf. Solid-State Sensors and Actuators, Transducers'01 EurosensorsXV, vol. 2, 2001, pp. 1114-1117.
21. D.J. Young, V. Malba, J.-J. Ou, A. F. Bernhardt, and B. E. Boser, "Monolithic high-performance three-dimensional coil inductors for wireless communication applicatiorts," in IEEE Electron Dev. Meeting Tech. Dig., Dec. 1997, pp. 67-70.
22. Y.-H. Joung, S. Nuttinck, S.-W. Yoon, M. G. Allen, and J. Laskar, "Integrated inductors in the chip-to-board interconnect layer fabricated using solderless electroplating bonding," in IEEE Int. Microw. Symp. Dig., vol. 3, Jun. 2002, pp. 1409-1412.