Resist re-hydration during thick film processing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4345, Issue 1, 2001, Pages 463-474

  Lehar, Octavia P ^a   Spak, Mark ^a   Meyer, Stephen ^a   Dammel, Ralph R ^a   Brodsky, Colin ^b   Willson, C Grant ^b  

^a CLARIANT CORPORATION   (United States)

^b The University of Texas at Austin   (United States)

Author keywords

Diffusion; Photoresist; Photospeed; Re hydration; Sorption; Thick film; Water

Indexed keywords

DISSOLUTION; HYDRATION; MICROELECTROMECHANICAL DEVICES; PHOTOLYSIS; PHOTORESISTS; SORPTION;

PHOTORESIST FILMS;

THICK FILMS;

EID: 0034758249     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436878     Document Type: Article

References (15)

1. Lithographic Performance of a Positive Photoresist for Thick Film Applications
2. Solvent Content of Thick Photoresist Films
3. Thermal stability of naphthodiazoquinone sensitizers
4. Influence of Water on Photochemical Reaction of Positive-Type Photoresist
5. Cinetique de la diffusion de l’eau dans un film mince de photoresist
6. Investigation of Deep UV Resists by NMR: Residual Casting Solvents, Chemistries, and PAG Decomposition in Film
7. Molecular Basis for the Interaction Between Novolaks and Diazonaphthoquinone Photoactive Compounds
8. Non-chemically amplified 248 nm resist materials