-
1
-
-
14944355334
-
A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps
-
Voigt A, Heinrich M, Hauck K, Mientus R, Gruetzner G, Töpper M and Ehrmann O 2005 A single layer negative tone lift-off photo resist for patterning a magnetron sputtered Ti/Pt/Au contact system and for solder bumps Microelectron. Eng. 78-79 503-8
-
(2005)
Microelectron. Eng.
, vol.78-79
, pp. 503-508
-
-
Voigt, A.1
Heinrich, M.2
Hauck, K.3
Mientus, R.4
Gruetzner, G.5
Töpper, M.6
Ehrmann, O.7
-
2
-
-
0016988893
-
Metallization for integrated circuits using a lift-off technique
-
Widmann D W 1976 Metallization for integrated circuits using a lift-off technique J. Solid-State Circuits 11 466-71
-
(1976)
J. Solid-State Circuits
, vol.11
, Issue.4
, pp. 466-471
-
-
Widmann, D.W.1
-
3
-
-
0001074665
-
High aspect-ratio fine-line metallization
-
Chang C, Chang P, Yen K and Lu S 1998 High aspect-ratio fine-line metallization Proc. SPIE 3511 357-63
-
(1998)
Proc. SPIE
, vol.3511
, pp. 357-363
-
-
Chang, C.1
Chang, P.2
Yen, K.3
Lu, S.4
-
4
-
-
27144459480
-
Double-layer resist films for submicrometer electron-beam lithography
-
Todokoro Y 1980 Double-layer resist films for submicrometer electron-beam lithography J. Solid-State Circuits 15 508-13
-
(1980)
J. Solid-State Circuits
, vol.15
, Issue.4
, pp. 508-513
-
-
Todokoro, Y.1
-
5
-
-
0020734887
-
Lift-off process for achieving fine-line metallization
-
Milgram A A 1983 Lift-off process for achieving fine-line metallization J. Vac. Sci. Technol. B 1 490-3
-
(1983)
J. Vac. Sci. Technol.
, vol.1
, Issue.2
, pp. 490-493
-
-
Milgram, A.A.1
-
6
-
-
0029463225
-
A new technique to fabricate overhanging structure for forming IC metal patterns by lift-off
-
Zhang S, Li W, Lin H, Zhu B, Fan C, Lu J, Xing J and Zhu B 1995 A new technique to fabricate overhanging structure for forming IC metal patterns by lift-off ICSICT'95 pp 41-3
-
(1995)
ICSICT'95
, pp. 41-43
-
-
Zhang, S.1
Li, W.2
Lin, H.3
Zhu, B.4
Fan, C.5
Lu, J.6
Xing, J.7
Zhu, B.8
-
7
-
-
1442267422
-
Dielectric-assisted trilayer lift-off process for improved metal definition
-
Ryan R W, Kopf R F, Hamm R A, Malik R J, Massitis R and Opila R 1998 Dielectric-assisted trilayer lift-off process for improved metal definition J. Vac. Sci. Technol. B 16 2759-62
-
(1998)
J. Vac. Sci. Technol.
, vol.16
, Issue.5
, pp. 2759-2762
-
-
Ryan, R.W.1
Kopf, R.F.2
Hamm, R.A.3
Malik, R.J.4
Massitis, R.5
Opila, R.6
-
8
-
-
0042941798
-
High resolution metal lift-off characterization
-
Sutton A K and Steen S 2003 High resolution metal lift-off characterization Proc. UGIM pp 94-8
-
(2003)
Proc. UGIM
, pp. 94-98
-
-
Sutton, A.K.1
Steen, S.2
-
9
-
-
17344388742
-
A lift-off process for high resolution patterns using PMMA/LOR resist stack
-
Chen Y, Peng K and Cui Z 2004 A lift-off process for high resolution patterns using PMMA/LOR resist stack Microelectron. Eng. 73-74 278-81
-
(2004)
Microelectron. Eng.
, vol.73-74
, pp. 278-281
-
-
Chen, Y.1
Peng, K.2
Cui, Z.3
-
11
-
-
0021784964
-
Single-step lift-off process using chlorobenzene soak on AZ4000 resist
-
Fathimulla A 1985 Single-step lift-off process using chlorobenzene soak on AZ4000 resist J. Vac. Sci. Technol. B 3 25-7
-
(1985)
J. Vac. Sci. Technol.
, vol.3
, Issue.1
, pp. 25-27
-
-
Fathimulla, A.1
-
12
-
-
0032632472
-
Lithographic process for high-resolution metal lift-off
-
Redd R, Spak M, Sagan J, Lehar O and Dammel R 1999 Lithographic process for high-resolution metal lift-off Proc. SPIE 3678 641-51
-
(1999)
Proc. SPIE
, vol.3678
, pp. 641-651
-
-
Redd, R.1
Spak, M.2
Sagan, J.3
Lehar, O.4
Dammel, R.5
-
13
-
-
0141499161
-
TMAH soak process optimization with DNQ positive resist for lift-off applications
-
Mullen S, Toukhy M, Lu P H, Dixit S and Sellers P 2003 TMAH soak process optimization with DNQ positive resist for lift-off applications Proc. SPIE 5039 1304-11
-
(2003)
Proc. SPIE
, vol.5039
, pp. 1304-1311
-
-
Mullen, S.1
Toukhy, M.2
Lu, P.H.3
Dixit, S.4
Sellers, P.5
-
15
-
-
11244283329
-
Shape-controlled high fill-factor microlens arrays fabricated with a 3D diffuser lithography and plastic replication method
-
Chang S-I and Yoon J-B 2004 Shape-controlled high fill-factor microlens arrays fabricated with a 3D diffuser lithography and plastic replication method Opt. Express 12 6366-71
-
(2004)
Opt. Express
, vol.12
, Issue.25
, pp. 6366-6371
-
-
Chang, S.-I.1
Yoon, J.-B.2
-
16
-
-
26844461517
-
High power handling RF MEMS design and technology
-
Grenier K, Dubuc D, Ducarouge B, Conedera V, Bourrier D, Ongareau E, Derderian P and Plana R 2005 High power handling RF MEMS design and technology Proc. MEMS'05 pp 155-8
-
(2005)
Proc. MEMS'05
, pp. 155-158
-
-
Grenier, K.1
Dubuc, D.2
Ducarouge, B.3
Conedera, V.4
Bourrier, D.5
Ongareau, E.6
Derderian, P.7
Plana, R.8
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