Effect of exposure intensity on the photochemical reaction speed of the lithography for thick film resists

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5878, Issue , 2005, Pages 1-9

  Guo, Yongkang ^a   Tang, Xionggui ^a   Zhu, Jianhua ^a   Du, Jinglei ^a  

^a SICHUAN UNIVERSITY   (China)

Author keywords

Exposure intensity; Kinetic model; Photochemical reaction; Thick resist lithography

Indexed keywords

MATHEMATICAL MODELS; PHOTOCHEMICAL REACTIONS; PHOTOLITHOGRAPHY; PHOTORESISTS;

EXPOSURE INTENSITY; KINETIC MODEL; THICK RESIST LITHOGRAPHY;

THICK FILMS;

EID: 29244442751     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.619210     Document Type: Conference Paper

References (15)

1. Y. Hirata, LIGA process: micromachining technique using synchrotron radiation lithography and some industrial applications, Nuclear Instruments and Methods in Physics Research B, 208, 21-26(2003)
2. P. M. Dentinger, K. L. Krafcik, and K. L. Simison, et al., High aspect ratio patterning with a proximity ultraviolet source, Microelectronic Engineering, 61-62, 1001-1007(2002)
3. W. Flack and H. Nguyen et al., Characterization of an ultra-thick positive photoresist for electroplating applications, SPIE, Vol. 5039, 1257-1271(2003)
4. M. Kubenz, U. Ostrzinski and F. Reuther et al., Challenges of processing thick and ultra-thick photoresist films, SPIE, Vol. 5039, 1272-1280(2003)
5. O. Lehar and K. jensen, Develop temperature and process study on a thick film photoresist, SPIE, Vol. 3678, 689-700(1999)
6. Graham Arthur, Modifying the surface inhibition layer of thick resists for improved process control, SPIE, Vol. 4404, 372-379(2001)
7. Warren W. Flack, Gary Newman and D. Bernard et al., Advanced simulation techniques for thick photoresist lithography, SPIE, Vol. 3049, 789-804(1997)
8. Graham Arthur and Brian Martin, Enhancing the development rate model in optical lithography simulation of ultra-thick films for applications suck as MEMS and LIGA, SPIE, Vol. 4404, 209-220(2001)
9. P. Baluswamy and T. R. Glass, Exposure effects on deep ultraviolet resist thickness, SPIE, Vol. 3334, 814-819(1998)
10. T. Abe, T. Arikado and T. Takigawa, Resist heating in excimer laser lithography, J. Appl. Phys., 63(4), 1235-1237(1988)
11. C. A. Mack, Absorption and exposure in positive photoresist, Appl. Opt., 27(23), 4913-4919(1988)
12. Arnost Reiser, The molecular mechanism of novolak resists, Journal of Imaging Science and Technology, 42(1), 15-22(1998)
13. Song Xinqi, Zhou Futian, Liu Jianbo, Photochemistry principles techniques application, Beijing: Higher Education Press, 2001(in Chinese)
14. Tang Xionggui, Guo Yongkang, Du Jinglei, et al., Study of Diffractive Field Based Angular Spectrum Theory in Thick Film Photoresist, Acta Optic Sinica, 24(12), 1691-1696(2004)(in Chinese)
15. G. E. Flores, W. W. Flack and E. Tai, Investigation of the properties of thick photoresist films, SPIE, Vol. 2195, 734-751(1994)