Supercritical fluids for the fabrication of semiconductor devices: Emerging or missed opportunities?

Chemical Reviews

Volumn 110, Issue 1, 2010, Pages 459-478

  Romang, Alvin H ^a   Watkins, James J ^a  

^a UNIVERSITY OF MASSACHUSETTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALTERNATIVE ENERGY GENERATION; CAPACITOR STRUCTURES; FULL SCALE; HIGH ASPECT RATIO STRUCTURES; HIGH THROUGHPUT; HYBRID APPROACH; INTERCONNECT TECHNOLOGY; NANOSCALE FEATURES; NICHE APPLICATIONS; RESIST DEVELOPMENT; SUPERCRITICAL CONDITION; SURFACE MODIFICATION; WAFER PROCESSING;

ASPECT RATIO; CLEANING; DIELECTRIC FILMS; EFFLUENT TREATMENT; GAS PERMEABLE MEMBRANES; SEMICONDUCTOR DEVICE MANUFACTURE; SUPERCRITICAL FLUIDS;

SEMICONDUCTOR DEVICES;

EID: 75649149114     PISSN: 00092665     EISSN: 15206890     Source Type: Journal    
DOI: 10.1021/cr900255w     Document Type: Article

References (151)

1. McHugh, M.; Krukonis, V. SupercriticalFluidExtraction; Butterworth-Heinemann: Boston, 1993.
2. O'Neil, A.; Watkins, J. J. MRS Bull. 2005, 30, 967.
3. Hoggan, E. N.; Wang, K.; Flowers, D.; DeSimone, J. M.; Carbonell, R. G. IEEE Trans. Semicond. Manuf. 2004, 17, 510.
4. Jones, C. A.; Zweber, A.; DeYoung, J. P.; McClain, J. B.; Carbonell, R.; DeSimone, J. M. Crit. Rev. Solid State Mater. Sci. 2004, 29, 97.
5. King, J. W.; Williams, L. L. Curr. Opin. Solid State Mater. Sci. 2003, 7, 413.
6. O'Neil, A.; Watkins, J. J. Green Chem. 2004, 6, 363.
7. Weibel, G. L.; Ober, C. K. Microelectron. Eng. 2003, 65, 145.
8. Zhang, X. G.; Johnston, K. P. Chin. Sci. Bull. 2007, 52, 27.
9. Mount, D. J.; Rothman, L. B.; Robey, R. J. Solid State Technol. 2002, 45, 103.
10. Aymonier, C.; Loppinet-Serani, A.; Reveron, H.; Garrabos, Y.; Cansell, F. J. Supercrit. Fluids 2006, 38, 242.
11. Reverchon, E.; Adami, R. J. Supercrit. Fluids 2006, 37, 1.
12. Cansell, F.; Aymonier, C.; Loppinet-Serani, A. Curr. Opin. Solid State Mater. Sci. 2003, 7, 331.
13. Cooper, A. I. J. Mater. Chem. 2000, 10, 207.
14. Darr, J. A.; Poliakoff, M. Chem. Rev. 1999, 99, 495.
15. Cooper, A. I.; DeSimone, J. M. Curr. Opin. Solid State Mater. Sci. 1996, 1, 761.
16. Savage, P. E.; Gopalan, S.; Mizan, T. I.; Martino, C. J.; Brock, E. E. AIChE J. 1995, 41, 1723.
17. Cooper, A. I. Adv. Mater. 2003, 15, 1049.
18. Tomasko, D. L.; Li, H. B.; Liu, D. H.; Han, X. M.; Wingert, M. J.; Lee, L. J.; Koelling, K. W. Ind. Eng. Chem. Res. 2003, 42, 6431.
19. Linstrom, P. J.; Mallard, W. G. National Institute of Standards and Technology, Gaithersburg, MD, web site http://webbook.nist.gov.
20. Zong, Y. F. Ph.D. Thesis, University of Massachusetts, 2005.
21. Chandler, C. M.; Vogt, B. D.; Francis, T. J.; Watkins, J. J. Macromolecules , 42, 4867.
22. Wissinger, R. G.; Paulaitis, M. E. J. Polym. Sci. Polym. Phys. 1991, 29, 631.
23. Wang, W.-C. V.; Kramer, E. J.; Sachse, W. H. J. Polym. Sci., Part B: Polym. Phys. 1982, 20, 1371.
24. Gupta, R. R.; Ramachandra Rao, V. S.; Watkins, J. J. Macromolecules 2003, 36, 1295.
25. Watkins, J. J.; McCarthy, T. J. Macromolecules 1995, 28, 4067.
26. Kirby, C. F.; McHugh, M. A. Chem. Rev. 1999, 99, 565.
27. Hansen, B. N.; Hybertson, B. M.; Barkley, R. M.; Sievers, R. E. Chem. Mater. 1992, 4, 749.
28. Popov, V. K.; Bagratashvili, V. N.; Antonov, E. N.; Lemenovski, D. A. Thin Solid Films 1996, 279, 66.
29. Blackburn, J. M.; Long, D. P.; Cabanas, A.; Watkins, J. J. Science 2001, 294, 141.
30. Watkins, J. J.; McCarthy, T. J. U.S. Patent 5789027, 1998.
31. Brissonneau, L.; Vahlas, C. Chem. Vap. Deposition 1999, 5, 135.
32. Brissonneau, L.; de Caro, D.; Boursier, D.; Madar, R.; Vahlas, C. Chem. Vap. Deposition 1999, 5, 143.
33. Karanikas, C. F.; Watkins, J. J. Microelectron. Eng. 2009, DOI: 10.1016/j.mee.2009.08.011.
34. Kondoh, E.; Fukuda, J. In 8th International Symposium on Supercritical Fluids, Kyoto, Japan, 2006; p 466.
35. Zong, Y. F.; Watkins, J. J. In 21st Advanced Metallization Conference (AMC 2004), San Diego, CA; Erb, D., Ramm, P., Masu, K., Osaki, A., Eds.; 2004; p 353.
36. Cabanas, A.; Shan, X. Y.; Watkins, J. J. Chem. Mater. 2003, 15, 2910.
37. Blackburn, J. M.; Long, D. P.; Watkins, J. J. Chem. Mater. 2000, 12, 2625.
38. Hunde, E. T.; Watkins, J. J. Chem. Mater. 2004, 16, 498.
39. Long, D. P.; Blackburn, J. M.; Watkins, J. J. Adv. Mater. 2000, 12, 913.
40. Watkins, J. J.; Blackburn, J. M.; McCarthy, T. J. Chem. Mater. 1999, 11, 213.
41. Cabanas, A.; Long, D. P.; Watkins, J. J. Chem. Mater. 2004, 16, 2028.
42. O'Neil, A.; Watkins, J. J. Chem. Mater. 2006, 18, 5652.
43. Kondoh, E. Jpn. J. Appl. Phys., Part 1 2004, 43, 3928.
44. Erkey, C. J. Supercrit. Fluids 2009, 47, 517.
45. Fernandes, N. E.; Fisher, S. M.; Poshusta, J. C.; Vlachos, D. G.; Tsapatsis, M.; Watkins, J. J. Chem. Mater. 2001, 13, 2023.
46. Kondoh, E.; Shigama, K. Thin Solid Films 2005, 491, 228.
47. Matsubara, M.; Hirose, M.; Tamai, K.; Shimogaki, Y.; Kondoh, E. J. Electrochem. Soc. 2009, 156, H443.
48. Peng, Q.; Spagnola, J. C.; Parsons, G. N. J. Electrochem. Soc. 2008, 155, D580.
49. Lin, C. S.; Lam, F. L. Y.; Hu, X. J.; Tam, W. Y.; Ng, K. M. J. Phys. Chem. C 2008, 112, 10068.
50. Zhao, B.; Momose, T.; Ohkubo, T.; Shimogaki, Y. Microelectron. Eng. 2008, 85, 675.
51. Tsang, C. Y.; Streett, W. B. Chem. Eng. Sci. 1981, 36, 993.
52. Gurdial, G. S.; Foster, N. R.; Yun, S. L. J.; Tilly, K. D. ACS Symp. Ser. 1993, 514, 34.
53. Zhu, H. G.; Tian, Y. L.; Chen, L.; Qin, Y.; Feng, J. J. Chin. J. Chem. Eng. 2001, 9, 322.
54. Zong, Y. F.; Watkins, J. J. Chem. Mater. 2005, 17, 560.
55. Kim, D. H.; Wentorf, R. H.; Gill, W. N. J. Electrochem. Soc. 1993, 140, 3267.
56. Shan, X. Y.; Schmidt, D. P.; Watkins, J. J. J. Supercrit. Fluids 2007, 40, 84.
57. Cabanas, A.; Blackburn, J. M.; Watkins, J. J. In European Workshop on Materials for Advanced Metallization, Vaals, The Netherlands, 2002; p 53.
58. Momose, T.; Ohkubo, T.; Sugiyama, M.; Shimogaki, Y. Thin Solid Films 2008, 517, 674.
59. Zong, Y. F.; Shan, X. Y.; Watkins, J. J. Langmuir 2004, 20, 9210.
60. Karanikas, C. F.; Han, L.; Vlassak, J. J.; Watkins, J. J. J. Eng. Mater. Technol. 2009, in press.
61. Momose, T.; Sugiyama, M.; Shimogaki, Y. Jpn. J. Appl. Phys. 2008, 47, 885.
62. Ritzdorf, T. In Advanced Metallization Conference 2006, San Diego, CA; Russell, S. W., Mills, M. E., Osaki, A., Yoda, T., Eds.; 2006; p 69.
63. Blackburn, J. M. ; Gaynor, J.; Drewery, J.; Hunde, E.; Watkins, J. J. In Advanced Metallization Conference 2003 (AMC 2003), Montreal; Ray, G. W., Smy, T., Ohta, T., Tsujimura, M., Eds.; 2003; p 601.
64. Watkins, J. J.; Blackburn, J. M.; Long, D. P.; Lazorcik, J. L. U.S. Patent 6689700, 2004.
65. Ohde, H.; Kramer, S.; Moore, S.; Wai, C. M. Chem. Mater. 2004, 16, 4028.
66. Ye, X. R.; Wai, C. M.; Zhang, D. Q.; Kranov, Y.; McIlroy, D. N.; Lin, Y. H.; Engelhard, M. Chem. Mater. 2003, 15, 83.
67. Kim, J.; Taylor, D.; DeYoung, J.; McClain, J. B.; DeSimone, J. M.; Carbonell, R. G. Chem. Mater. 2009, 21, 913.
68. Ramesh, R.; Aggarwal, S.; Auciello, O. Mater. Sci. Eng., R 2001, 32, 191.
69. Oishi, N.; Atkinson, A.; Brandon, N. P.; Kilner, J. A.; Steele, B. C. H. J. Am. Ceram. Soc. 2005, 88, 1394.
70. Trovarelli, A. Catal. Rev.-Sci. Eng. 1996, 38, 439.
71. Kuomoto, K.; Terasaki, I.; Funahashi, R. MRS Bull. 2006, 31, 206.
72. Tokura, Y.; Takagi, H.; Uchida, S. Nature 1989, 337, 345.
73. Uchida, H.; Otsubo, A.; Itatani, K.; Koda, S. Jpn. J. Appl. Phys., Part 1 2005, 44, 1901.
74. Gougousi, T.; Barua, D.; Young, E. D.; Parsons, G. N. Chem. Mater. 2005, 17, 5093.
75. Gougousi, T.; Chen, Z. Y. Thin Solid Films 2008, 516, 6197.
76. Peng, Q.; Hojo, D.; Park, K. J.; Parsons, G. N. Thin Solid Films 2008, 516, 4997.
77. O'Neil, A.; Watkins, J. J. Chem. Mater. 2007, 19, 5460.
78. Lee, J. H.; Son, J. Y.; Lee, H. B. R.; Lee, H. S.; Ma, D. J.; Lee, C. S.; Kim, H. J. Electrochem. Solid-State Lett. 2009, 12, D45.
79. Tsai, C. T.; Chang, T. C.; Kin, K. T.; Liu, P. T.; Yang, P. Y.; Weng, C. F.; Huang, F. S. J. Appl. Phys. 2008, 103.
80. Tsai, C. T.; Chang, T. C.; Liu, P. T.; Cheng, Y. L.; Kin, K. T.; Huang, F. S. Electrochem. Solid-State Lett. 2009, 12, H35.
81. Yang, J.; Hyde, J. R.; Wilson, J. W.; Mallik, K.; Sazio, P. J.; O'Brien, P.; Malik, M. A.; Afzaal, M.; Nguyen, C. Q.; George, M. W.; Howdle, S. M.; Smith, D. C. Adv. Mater. 2009, 21, 4115.
82. Jessop, P. G. In 7th International Conference on Carbon Dioxide Utilization, Seoul, South Korea; Park, S. E., Chang, J. S., Lee, K. W., Eds.; 2003, p 355.
83. Jessop, P. G.; Subramaniam, B. Chem. Rev. 2007, 107, 2666.
84. Xie, B.; Finstad, C. C.; Muscat, A. J. Chem. Mater. 2005, 17, 1753.
85. Bae, J. H.; Alam, M. Z.; Jung, J. M.; Gal, Y. S.; Lee, H.; Kim, H. G.; Lim, K. T. In 10th Annual SEMATECH Surface Preparation and Cleaning Conference (SPCC), Austin, TX, 2008, p 128.
86. Bessel, C. A.; Denison, G. M.; DeSimone, J. M.; DeYoung, J.; Gross, S.; Schauer, C. K.; Visintin, P. M. J. Am. Chem. Soc. 2003, 125, 4980.
87. Dunbar, A.; Omiatek, D. M.; Thai, S. D.; Kendrex, C. E.; Grotzinger, L. L.; Boyko, W. J.; Weinstein, R. D.; Skaf, D. W.; Bessel, C. A.; Denison, G. M.; DeSimone, J. M. Ind. Eng. Chem. Res. 2006, 45, 8779.
88. Shan, X. Y.; Watkins, J. J. Thin Solid Films 2006, 496, 412.
89. Ventosa, C.; Rebiscoul, D.; Perrut, V.; Ivanova, V.; Renault, O.; Passemard, G. Microelectron. Eng. 2008, 85, 1629.
90. Durando, M.; Morrish, R.; Muscat, A. J. J. Am. Chem. Soc. 2008, 130, 16659.
91. Jones, C. A.; Yang, D. X.; Irene, E. A.; Gross, S. M.; Wagner, M.; DeYoung, J.; DeSimone, J. M. Chem. Mater. 2003, 15, 2867.
92. Li, Y. X.; Yang, D.; Jones, C. A.; DeSimone, J. M.; Irene, E. A. J. Vac. Sci. Technol., B 2007, 25, 1139.
93. Goldfarb, D. L.; de Pablo, J. J.; Nealey, P. F.; Simons, J. P.; Moreau, W. M.; Angelopoulos, M. J. Vac. Sci. Technol., B 2000, 18, 3313.
94. Namatsu, H. J. Photopolym. Sci. Technol. 2002, 15, 381.
95. Cotte, J. M.; Goldfarb, D. L.; McCullough, K. J.; Moreau, W. M.; Pope, K. R.; Simons, J. P.; Taft, C. J. (International Business Machines Corporation) U.S. Patent 6454869, 2002.
96. Namatsu, H. In 45th International Conference on Electron, Ion, and Photon Beam Technology and Nanofabrication, Washington, DC, 2001, p 2709.
97. Namatsu, H. In Conference on Advances in Resist Technology and Processing XXI, Santa Clara, CA; Sturtevant, J. L., Ed.; 2004; p 482.
98. Lee, M. Y.; Do, K. M.; Ganapathy, H. S.; Lo, Y. S.; Kim, J. J.; Choi, S. J.; Lim, K. T. J. Supercrit. Fluids 2007, 42, 150.
99. Sundararajan, N.; Yang, S.; Ogino, K.; Valiyaveettil, S.; Wang, J. G.; Zhou, X. Y.; Ober, C. K.; Obendorf, S. K.; Allen, R. D. Chem. Mater. 2000, 12, 41.
100. Pham, V. Q.; Ferris, R. J.; Hamad, A.; Ober, C. K. Chem. Mater. 2003, 15, 4893.
101. Flowers, D.; Hoggan, E. N.; Carbonell, R.; DeSimone, J. M. Proc. SPIE 2002, 419, 4690.
102. Felix, N.; Ober, C. K. Chem. Mater. 2008, 20, 2932.
103. Shiraishi, H.; Yamamoto, J.; Sakamizu, T. J. Photopolym. Sci. Technol. 2006, 19, 367.
104. De Silva, A.; Felix, N. M.; Ober, C. K. Adv. Mater. 2008, 20, 3355.
105. Felix, N. M.; De Silva, A.; Ober, C. K. Adv. Mater. 2008, 20, 1303.
106. Wagner, M.; DeYoung, J.; Harbinson, C. In Conference on Advances in Resist Technology and Processing XXIII, San Jose, CA; Lin, Q., Ed.; 2006; p U603.
107. Wagner, M.; DeYoung, J.; Harbinson, C.; Miles, M. In Conference on Advances in Resist Technology and Processing XXIII, San Jose, CA; Lin, Q., Ed.; 2006; p U1551.
108. Tanaka, M.; Rastogi, A.; Toepperwein, G. N.; Riggleman, R. A.; Felix, N. M.; de Pablo, J. J.; Ober, C. K. Chem. Mater. 2009, 21, 3125.
109. Zweber, A. E.; Wagner, M.; Carbonell, R. G. J. Phys. Chem. B 2009, 113, 9687.
110. Zweber, A. E.; Wagner, M.; DeYoung, J.; Carbonell, R. G. Langmuir 2009, 25, 6176.
111. Kim, S. H.; Yuvaraj, H.; Jeong, Y. T.; Park, C.; Kim, S. W.; Lim, K. T. Microelectron. Eng. 2009, 86, 171.
112. Fan, H. Y.; Hartshorn, C.; Buchheit, T.; Tallant, D.; Assink, R.; Simpson, R.; Kisse, D. J.; Lacks, D. J.; Torquato, S.; Brinker, C. J. Nat. Mater. 2007, 6, 418.
113. Gungor, M. R.; Watkins, J. J.; Maroudas, D. Appl. Phys. Lett. 2008, 92, 3.
114. Bates, F. S.; Fredrickson, G. H. Phys. Today 1999, 52, 32.
115. Hawker, C. J.; Russell, T. P. MRS Bull. 2005, 30, 952.
116. Tirumala, V. R.; Romang, A.; Agarwal, S.; Lin, E. K.; Watkins, J. J. Adv. Mater. 2008, 20, 1603.
117. Segalman, R. A.; Yokoyama, H.; Kramer, E. J. Adv. Mater. 2001, 13, 1152.
118. Stoykovich, M. P.; Muller, M.; Kim, S. O.; Solak, H. H.; Edwards, E. W.; de Pablo, J. J.; Nealey, P. F. Science 2005, 308, 1442.
119. Gupta, R. R.; Lavery, K. A.; Francis, T. J.; Webster, J. R. P.; Smith, G. S.; Russell, T. P.; Watkins, J. J. Macromolecules 2003, 36, 346.
120. Vogt, B. D.; Brown, G. D.; Ramachandra Rao, V. S.; Watkins, J. J. Macromolecules 1999, 32, 7907.
121. Vogt, B. D.; RamachandraRao, V. S.; Gupta, R. R.; Lavery, K. A.; Francis, T. J.; Russell, T. P.; Watkins, J. J. Macromolecules 2003, 36, 4029.
122. Tanaka, S.; Hillhouse, H. W. Chem. Lett. 2006, 35, 928.
123. Pai, R. A.; Humayun, R.; Schulberg, M. T.; Sengupta, A.; Sun, J. N.; Watkins, J. J. Science 2004, 303, 507.
124. Pai, R. A.; Watkins, J. J. Adv. Mater. 2006, 18, 241.
125. Tirumala, V. R.; Pai, R. A.; Agarwal, S.; Testa, J. J.; Bhatnagar, G.; Romang, A. H.; Chandler, C.; Gorman, B. P.; Jones, R. L.; Lin, E. K.; Watkins, J. J. Chem. Mater. 2007, 19, 5868.
126. Geraud, D.; Magbitang, T.; Volksen, W.; Simonyi, E. E.; Miller, R. D. In IEEE International Interconnect Technology Conference 2005; IEEE: Burlingame, CA, 2005, p 226.
127. Vogt, B. D.; Pai, R. A.; Lee, H. J.; Hedden, R. C.; Soles, C. L.; Wu, W. L.; Lin, E. K.; Bauer, B. J.; Watkins, J. J. Chem. Mater. 2005, 17, 1398.
128. Li, X. X.; Vogt, B. D. Chem. Mater. 2008, 20, 3229.
129. Li, X.; Song, L. Y.; Vogt, B. D. J. Phys. Chem. C 2008, 112, 53.
130. Nagarajan, S.; Bosworth, J. K.; Ober, C. K.; Russell, T. P.; Watkins, J. J. Chem. Mater. 2008, 20, 604.
131. Nagarajan, S.; Li, M. Q.; Pai, R. A.; Bosworth, J. K.; Busch, P.; Smilgies, D. M.; Ober, C. K.; Russell, T. P.; Watkins, J. J. Adv. Mater. 2008, 20, 246.
132. Du, P.; Li, M. Q.; Douki, K.; Li, X. F.; Garcia, C. R. W.; Jain, A.; Smilgies, D. M.; Fetters, L. J.; Gruner, S. M.; Wiesner, U.; Ober, C. K. Adv. Mater. 2004, 16, 953.
133. Gates, S. M.; Grill, A.; Dimitrakopoulos, C.; Restaino, D.; Lane, M.; Patel, V.; Cohen, S.; Simonyi, E.; Liniger, E.; Ostrovski, Y.; Augur, R.; Sherwood, M.; Klymko, N.; Molis, S.; Landers, W.; Edelstein, D.; Sankaran, S.; Wisnieff, R.; Ivers, T.; Yim, K.; Nguyen, V.; Nowak, T.; Rocha, J. C.; Reiter, S.; Demos, A. In Advanced Metallization Conference 2006, San Diego, CA; Russell, S. W., Mills, M. E., Osaki, A., Yoda, T., Eds.; 2006, p 351.
134. Grill, A. Annu. Rev. Mater. Res. 2009, 39, 49.
135. Berry, I. L.; Waldfried, C.; Durr, K. In Symposium on Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro-and Nanoelectronics, San Francisco, CA; Lin, Q., Ryan, E. T., Wu, W., Yoon, D. Y., Eds.; 2007, p 15.
136. Pai, R. A.; Watkins, J. J. 2006, unpublished data.
137. Lubguban, A. A.; Lubguban, J. A.; Othman, M. T.; Shende, R. V.; Gangopadhyay, S.; Miller, R. D.; Volksen, W.; Kim, H. C. Thin Solid Films 2008, 516, 4733.
138. Lubguban, J. A.; Gangopadhyay, S.; Lahlouh, B.; Rajagopalan, T.; Biswas, N.; Sun, J.; Huang, D. H.; Simon, S. L.; Mallikarjunan, A.; Kim, H. C.; Hedstrom, J.; Volksen, W.; Miller, R. D.; Toney, M. F. J. Mater. Res. 2004, 19, 3224.
139. Schmid, G. M.; Stewart, M. D.; Wetzel, J.; Palmieri, F.; Hao, J. J.; Nishimura, Y.; Jen, K.; Kim, E. K.; Resnick, D. J.; Liddle, J. A.; Willson, C. G. J. Vac. Sci. Technol., B 2006, 24, 1283.
140. Nagarajan, S.; Bosworth, J. K.; Ober, C. K.; Russell, T. P.; Watkins, J. J. In 24th Advanced Metallization Conference 2007 (AMC), Albany, NY; McKerrow, A. J., ShachamDiamand, Y., Shingubara, S., Shi-mogaki, Y., Eds.; 2007, p 495.
141. Nagarajan, S.; Russell, T. P.; Watkins, J. J. Adv. Funct. Mater. 2009, 19, 2728.
142. Cao, C. T.; Fadeev, A. Y.; McCarthy, T. J. Langmuir 2001, 17, 757.
143. Combes, J. R.; White, L. D.; Tripp, C. P. Langmuir 1999, 15, 7870.
144. Gorman, B. P.; Orozco-Teran, R. A.; Zhang, Z.; Matz, P. D.; Mueller, D. W.; Reidy, R. F. J. Vac. Sci. Technol., B 2004, 22, 1210.
145. Xie, B.; Choate, L.; Muscat, A. J. In 14th Biennial Conference on Insulating Films on Semiconductors, Leuven, Belgium, 2005, p 349.
146. Xie, B.; Muscat, A. J. In European Workshop on Materials for Advanced Metallization (MAM2004), Brussels, Belgium, 2004, p 52.
147. Xie, B.; Muscat, A. J. In European Workshop on Materials for Advanced Metallization, Dresden, Germany, 2005, p 434.
148. Xie, B.; Muscat, A. J.; Busch, E.; Rhoad, T. In 21st Advanced Metallization Conference (AMC 2004), San Diego, CA; Erb, D., Ramm, P., Masu, K., Osaki, A., Eds.; 2004; p 475.
149. Chen, H. T.; Crosby, T. A.; Park, M. H.; Nagarajan, S.; Rotello, V. M.; Watkins, J. J. Mater. Chem. 2009, 19, 70.
150. Rothman, L. Supercritical CO2 Tools and Applications for Semiconductors. NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing Annual Retreat, August 21-22, 2003; SC Fluids, Inc.: Nashua, NH, 2003; available at http://www.nsfstc.unc.edu/.
151. Product Data DFP, 200-Dense Fluid Processor High-Precision Advanced Wafer Chamber; BOC Edwards: Wilmington, MA, 2002.