Deposition of copper particles and films by the displacement of two immiscible supercritical phases and subsequent reaction

Chemistry of Materials

Volumn 21, Issue 5, 2009, Pages 913-924

  Kim, Jaehoon ^a,d   Taylor, Douglas ^b   DeYoung, James ^b   McClain, James B ^b   DeSimone, Joseph M ^a,c   Carbonell, Ruben G ^a  

^a North Carolina State University   (United States)

^b Micell Technologies   (United States)

^c The University of North Carolina at Chapel Hill   (United States)

^d Korea Institute of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL COMPOSITION ANALYSIS; CONCENTRATION RANGES; COPPER PARTICLES; CU FILMS; CU(HFAC)2; FILM FORMATIONS; HIGH AFFINITIES; HIGH CONCENTRATIONS; MORPHOLOGY TRANSITIONS; NATIVE OXIDES; NUCLEATION AND GROWTHS; SECONDARY ION-MASS SPECTROMETRIES; SUPERCRITICAL PHASIS; SURFACE CONDITIONS; X-RAY PHOTOELECTRON SPECTROSCOPIES;

CHEMICAL VAPOR DEPOSITION; CONCENTRATION (PROCESS); COPPER OXIDES; DENDRITES (METALLOGRAPHY); DIELECTRIC MATERIALS; ELECTRODEPOSITION; FORMING; HIGH PERFORMANCE LIQUID CHROMATOGRAPHY; HYDROGEN; METALLIC FILMS; NUCLEATION; OXIDE FILMS; SECONDARY ION MASS SPECTROMETRY; SILICON COMPOUNDS; SPECTRUM ANALYSIS; SUBSTRATES; TIN; TITANIUM; TITANIUM NITRIDE; TUNGSTEN; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 65249083896     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm802659j     Document Type: Article

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