HF etchant solutions in supercritical carbon dioxide for "dry" etch processing of microelectronic devices

Chemistry of Materials

Volumn 15, Issue 15, 2003, Pages 2867-2869

  Jones III, Charles A ^a   Yang, Dongxing ^a   Irene, Eugene A ^a   Gross, Stephen M ^c   Wagner, Mark ^c   DeYoung, James ^c   DeSimone, Joseph M ^a,b  

^a University of North Carolina at Chapel Hill   (United States)

^b North Carolina State University   (United States)

^c Micell Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON DIOXIDE; HYDROFLUORIC ACID; MICROELECTRONICS; SILICON WAFERS; THIN FILMS;

ETCHANT SOLUTIONS;

ETCHING;

CARBON DIOXIDE; HYDROFLUORIC ACID; SILICON; SILICON DIOXIDE;

AQUEOUS SOLUTION; ARTICLE; CHEMICAL PROCEDURES; CLEANING; DEVICE INFECTION; ELECTRONICS; FILM; PROCESS DEVELOPMENT; STRUCTURE ANALYSIS; SUPERCRITICAL FLUID; SURFACE PROPERTY; THICKNESS;

EID: 0042266885     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm034235w     Document Type: Article

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