"Dry" lithography using liquid and supercritical carbon dioxide based chemistries and processes

IEEE Transactions on Semiconductor Manufacturing

Volumn 17, Issue 4, 2004, Pages 510-516

  Hoggan, Erik N ^a,b   Wang, Ke ^a   Flowers, Devin ^c,d   DeSimone, Joseph M ^a,c   Carbonell, Ruben G ^a  

^a North Carolina State University   (United States)

^b INTEL CORPORATION   (United States)

^c University of North Carolina at Chapel Hill   (United States)

^d DUPONT COMPANY   (United States)

Author keywords

Liquid and supercritical carbon dioxide; Lithography; Photoacid generator; Photoresist; Resist contrast; Resist sensitivity

Indexed keywords

DRY LITHOGRAPHY; PHOTOACID GENERATORS; RESIST CONTRAST; RESIST SENSITIVITY;

CARBON DIOXIDE; DENSITY (SPECIFIC GRAVITY); LITHOGRAPHY; MICROELECTRONICS; PHOTORESISTS; SPIN COATING; THIN FILMS; VISCOSITY;

SUPERCRITICAL FLUIDS;

EID: 9144259632     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2004.837002     Document Type: Article

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