Aqueous-based photoresist drying using supercritical carbon dioxide to prevent pattern collapse

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 18, Issue 6, 2000, Pages 3313-3317

  Goldfarb, Darío L ^a   De Pablo, Juan J ^a   Nealey, Paul F ^a   Simons, John P ^b   Moreau, Wayne M ^b   Angelopoulos, Marie ^b  

^a University of Wisconsin Madison   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CARBON DIOXIDE; DRYING; SOLVENTS; SUPERCRITICAL FLUIDS; SURFACE ACTIVE AGENTS; SURFACE TENSION;

PHOTORESIST DRYING; SUPERCRITICAL DRYING PROCESS;

PHOTORESISTS;

EID: 0034318269     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1313582     Document Type: Article

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