Kinetics of deposition of cu thin films in supercritical carbon dioxide solutions from a f-free copper(II) Β -diketone complex

Journal of the Electrochemical Society

Volumn 156, Issue 6, 2009, Pages

  Matsubara, Masahiro ^a   Hirose, Michiru ^a   Tamai, Kakeru ^a   Shimogaki, Yukihiro ^b   Kondoh, Eiichi ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION EQUILIBRIUM CONSTANTS; APPARENT ACTIVATION ENERGIES; COPPER COMPLEXES; CU THIN FILMS; DEPOSITION PARAMETERS; DEPOSITION TEMPERATURES; DIKETONE; FIRST-ORDER DEPENDENCES; GROWTH MECHANISMS; HYDROGEN CONCENTRATIONS; HYDROGEN REDUCTIONS; LANGMUIR; LANGMUIR-HINSHELWOOD; RATE EQUATIONS; REACTION SYSTEMS; SUPERCRITICAL CARBON DIOXIDES; TEMPERATURE DEPENDENCES; TEMPERATURE RANGES;

ACTIVATION ENERGY; ADSORPTION; CARBON DIOXIDE; CARBON FILMS; CONCENTRATION (PROCESS); COPPER COMPOUNDS; EQUILIBRIUM CONSTANTS; HYDROGEN; RATE CONSTANTS; SODIUM COMPOUNDS; SUPERCRITICAL FLUID EXTRACTION; THIN FILMS;

COPPER;

EID: 65449181070     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3110918     Document Type: Article

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