Deposition kinetics and narrow-gap-filling in Cu thin film growth from supercritical carbon dioxide fluids

Journal of Supercritical Fluids

Volumn 44, Issue 3, 2008, Pages 466-474

  Kondoh, Eiichi ^a   Fukuda, Junpei ^a  

^a UNIVERSITY OF YAMANASHI   (Japan)

Author keywords

Copper; Cu(hfac)2; Flow reactor; Supercritical carbon dioxide; Thin film deposition

Indexed keywords

CARBON DIOXIDE; CRYSTALLOGRAPHY; DEPOSITION; FILM GROWTH; THIN FILMS;

CRYSTALLOGRAPHIC TEXTURE; TEMPERATURE DEPENDENCE; THIN FILM DEPOSITION;

SUPERCRITICAL FLUIDS;

EID: 40049094850     PISSN: 08968446     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.supflu.2007.12.004     Document Type: Article

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