BGA brittle fracture - Alternative solder joint integrity test methods

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1194-1201

  Newman, Keith ^a  

^a SUN MICROSYSTEMS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

PACKAGE GEOMETRIES; SOLDER BALL SHEAR; SOLDER COMPOSITION;

BRITTLE FRACTURE; COMPOSITION; ELECTROLYTES; NICKEL ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

ELECTRONICS PACKAGING;

EID: 24644432659     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (23)

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