The mechanics of the solder ball shear test and the effect of shear rate

Materials Science and Engineering: A

Volumn 417, Issue 1-2, 2006, Pages 259-274

  Chia, Julian Yan Hon ^a   Cotterell, Brian ^a,b   Chai, Tai Chong ^c  

^a INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

^b UNIVERSITY OF SYDNEY   (Australia)

^c INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Fracture toughness; Interfacial failure; Pb free solder; SnPb solder

Indexed keywords

CHIP SCALE PACKAGES; EUTECTICS; FAILURE (MECHANICAL); FRACTURE TOUGHNESS; MICROELECTRONICS; OPTICAL MICROSCOPY; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH; TIN ALLOYS;

BALL GRID ARRAY (BGA); INTERFACIAL FAILURE; SHEAR RATE;

SOLDERING ALLOYS;

CHIP SCALE PACKAGES; EUTECTICS; FAILURE (MECHANICAL); FRACTURE TOUGHNESS; MICROELECTRONICS; OPTICAL MICROSCOPY; PRINTED CIRCUIT BOARDS; SHEAR STRENGTH; SOLDERING ALLOYS; TIN ALLOYS;

EID: 31044432819     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.064     Document Type: Article

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