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Volumn 32, Issue 12, 2003, Pages 1455-1462
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Comparisons of Experimental and Computed Crystal Rotations Caused by Slip in Crept and Thermomechanically Fatigued Dual-Shear Eutectic Sn-Ag Solder Joints
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Author keywords
Orientation imaging microscopy (OIM); Plasticity; Schmid factors; Slip; Sn 3.5Ag lead free solder
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Indexed keywords
ANISOTROPY;
CRACKS;
CREEP;
CRYSTAL ORIENTATION;
CRYSTALLOGRAPHY;
FINITE ELEMENT METHOD;
GRAIN BOUNDARIES;
MICROSTRUCTURE;
NUCLEATION;
PLASTICITY;
POLISHING;
SCANNING ELECTRON MICROSCOPY;
SURFACE TOPOGRAPHY;
THERMAL CYCLING;
THERMOMECHANICAL TREATMENT;
TIN ALLOYS;
ORIENTATION IMAGING MICROSCOPY (OIM);
SCHMID FACTORS;
SLIP;
SN-3.5AG LEAD-FRE SOLDER;
SOLDERED JOINTS;
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EID: 0942288659
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-003-0115-1 Document Type: Conference Paper |
Times cited : (29)
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References (15)
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