On the nature of the interface between Ag 3Sn intermetallics and Sn in Sn-3.5Ag solder alloys

Journal of Electronic Materials

Volumn 36, Issue 12, 2007, Pages 1615-1620

  Sidhu, Rajen S ^a   Madge, Shantanu V ^a,b   Deng, Xin ^a,c   Chawla, Nikhilesh ^a  

^a AZ 85281   (United States)

^b INTERNATIONAL ADVANCED RESEARCH CENTRE FOR POWDER METALLURGY AND NEW MATERIALS ARCI   (India)

^c KENNAMETAL INC   (United States)

Author keywords

Ag 3Sn; Orientation image microscopy; Pb free solder; Sn rich solder; Transmission electron microscopy

Indexed keywords

ORIENTATION IMAGING MICROSCOPY (OIM);

CRYSTAL ORIENTATION; INTERMETALLICS; SILVER ALLOYS; SOLDERING ALLOYS; TRANSMISSION ELECTRON MICROSCOPY;

INTERFACES (MATERIALS);

EID: 36148998707     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0239-9     Document Type: Article

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