High strain rate testing of solder interconnections

Soldering and Surface Mount Technology

Volumn 18, Issue 2, 2006, Pages 12-17

  Tsai, K T ^a   Liu, F L ^a   Wong, E H ^b   Rajoo, R ^b  

^a INSTRON   (United Kingdom)

^b INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

Electronic engineering; Joining processes; Reliability management; Solders

Indexed keywords

IMPACT TESTER; JOINING PROCESSES; RELIABILITY MANAGEMENT;

ELECTRONICS INDUSTRY; FAILURE (MECHANICAL); MICROELECTRONICS; MICROSTRUCTURE; SOLDERED JOINTS;

STRAIN RATE;

EID: 33646368168     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910610665080     Document Type: Article

References (4)

1. Bath, J., Handwerker, C. and Bradley, E. (2000), "Research update: lead-free solder alternatives", Circuit Assembly, May, pp. 31-40.
2. Date, M., Shoji, T., Fujiyoshi, M., Sato, K. and Tu, K.N. (2004), "Impact reliability of solder joints", Proceedings of the 54th IEEE Electronic Components and Technology Conference, Las Vegas, NV, pp. 668-74.
3. JEDEC (2003), "Board level drop test method of components for handheld electronic products", Standard JESD22-B111, JEDEC, Arlington, VA.
4. Siviour, C.R., Williamson, D.M., Palmer, S.J.P., Walley, S.M., Proud, W.G. and Field, J.E. (2003), "Dynamic properties of solders and solder joints", Journal of Physics, Vol. IV, France 110, pp. 477-82.