Microstructural effect on the creep strength of a Sn-3.5%Ag solder alloy

Journal of Electronic Materials

Volumn 32, Issue 1, 2003, Pages 5-8

  Wu, Kepeng ^a   Wade, Noboru ^b   Cui, Jie ^c   Miyahara, Kazuya ^c  

^a NAGOYA UNIVERSITY   (Japan)

^b Topy Industries Ltd   (Japan)

^c NONE

Author keywords

Ag3Sn; Cooling rate; Creeprupture strength; Intermetallics; Lead free solder alloy; Microstructure; Minimum creep rate; Sn 3.5 Ag alloy; Solidification

Indexed keywords

CREEP; CRYSTALLIZATION; MICROSTRUCTURE; SILVER ALLOYS; SOLIDIFICATION; TIN ALLOYS;

CREEP STRENGTH;

SOLDERING ALLOYS;

EID: 0037237107     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0245-5     Document Type: Article

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