Creep behavior of the ternary 95.5Sn-3.9Ag-0.6Cu solder: Part II-aged condition

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1473-1484

  Vianco, Paul T ^a   Rejent, Jerome A ^a   Kilgo, Alice C ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Constitutive model; Creep; Reliability; Tin silver copper (Sn Ag Cu) solder

Indexed keywords

AGING OF MATERIALS; CREEP; MATHEMATICAL MODELS; PLASTICITY; SOLDERING; THERMAL EFFECTS; VIBRATIONS (MECHANICAL);

AGING TREATMENT; CONSTITUTIVE MODELS; TIN-SILVER-COPPER (SN-AG-CU) SOLDER; UNIFIED CREEP-PLASTICITY (UCP);

TIN ALLOYS;

EID: 11344273356     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0089-7     Document Type: Conference Paper

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