Role of imposed cyclic straining on the stress relaxation behavior of eutectic Sn-3.5Ag solder joints

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 3, 2005, Pages 169-176

  Rhee, H ^a   Subramanian, K N ^a   Lee, A ^a  

^a Michigan State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; EUTECTICS; MECHANICAL TESTING; RESIDUAL STRESSES; SHEAR STRESS; SILVER ALLOYS; STRAIN RATE; STRESS ANALYSIS; STRESS RELAXATION; THERMAL EFFECTS; THERMAL EXPANSION; TIN ALLOYS;

CYCLIC SHEAR STRAINING; CYCLIC STRAINING; MONOTONIC SHEAR STRESSING; STRESS RELAXATION TESTS;

SOLDERED JOINTS;

EID: 15344339799     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10854-005-6597-2     Document Type: Article

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